Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
Type:
Grant
Filed:
December 30, 2014
Date of Patent:
October 10, 2017
Assignee:
Rohm and Haas Electronic Mateirals LLC
Inventors:
Zuhra I Niazimbetova, Maria Anna Rzeznik