Abstract: Underlying coating compositions are provided that comprise one or more resins comprising one or more modified imide groups. These coating compositions are particularly useful as antireflective layers for an overcoated photoresist layer. Preferred systems can be thermally treated to increase hydrophilicity of the composition coating layer to inhibit undesired intermixing with an overcoated organic composition layer, while rendering the composition coating layer removable with aqueous alkaline photoresist developer.
Type:
Grant
Filed:
September 25, 2007
Date of Patent:
June 4, 2013
Assignee:
Rohm and Haas Electronic Materials LLP
Inventors:
Anthony Zampini, Michael K. Gallagher, Vipul Jain, Owendi Ongayi
Abstract: Organometallic compounds containing an electron donating group-substituted alkenyl ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds.
Type:
Grant
Filed:
September 29, 2006
Date of Patent:
May 12, 2009
Assignee:
Rohm and Haas Electronics Materials LLP
Inventors:
Deodatta Vinayak Shenai-Khatkhate, Qing Min Wang
Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
Type:
Grant
Filed:
July 6, 2007
Date of Patent:
May 5, 2009
Assignee:
Rohm and Haas Electronic Materials LLP
Inventors:
Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst