Patents Assigned to Rokko Systems Pte Ltd.
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Patent number: 11791183Abstract: A unit sorting system comprising: a net table for receiving units and a unit lifter for depositing said units on the net table; the net table having a first and second zone; wherein the unit lifter is arranged to engage a batch of units and then deposit a first half of the batch to the first zone and deposit a first half of the batch to the second zone.Type: GrantFiled: December 13, 2021Date of Patent: October 17, 2023Assignee: Rokko Systems Pte LtdInventors: Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Patent number: 11706875Abstract: An IC unit unloading system including a chute and a drawer. The chute has a plurality of channels each arranged to receive a unit. The drawer is arranged to move along the chute and has a gate with a unit contact face proximate a top surface of the chute. The contact face is arranged to draw the units along the respective channel as the drawer moves along the chute, and to allow the units to slide laterally across the contact face from a first pitch of each channel to a second pitch. A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project the ball face downwards, then; washing the ball face.Type: GrantFiled: August 7, 2018Date of Patent: July 18, 2023Assignee: Rokko Systems Pte LtdInventors: Yun Suk Shin, Jong Jae Jung, Deok Chun Jang
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Patent number: 11476150Abstract: A process for sputtering a plurality of integrated circuit (“IC”) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.Type: GrantFiled: February 20, 2020Date of Patent: October 18, 2022Assignee: Rokko Systems PTE LTDInventors: Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Publication number: 20220189805Abstract: A unit sorting system comprising: a net table for receiving units and a unit lifter for depositing said units on the net table; the net table having a first and second zone; wherein the unit lifter is arranged to engage a batch of units and then deposit a first half of the batch to the first zone and deposit a first half of the batch to the second zone.Type: ApplicationFiled: December 13, 2021Publication date: June 16, 2022Applicant: Rokko Systems Pte LtdInventors: Jong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
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Patent number: 11183413Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.Type: GrantFiled: November 18, 2016Date of Patent: November 23, 2021Assignee: Rokko Systems Pte LtdInventors: Seung Ho Baek, Deok Chun Jang, Jong Jae Jung
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Patent number: 10907247Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.Type: GrantFiled: August 12, 2015Date of Patent: February 2, 2021Assignee: ROKKO SYSTEMS PTE LTDInventors: Chong Chen Gary Lim, Seung Ho Baek, Jong Jae Jung, Yun Suk Shin, Deok Chun Jang
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Publication number: 20200170119Abstract: A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units as to project a ball face downwards, then; washing the ball face.Type: ApplicationFiled: August 7, 2018Publication date: May 28, 2020Applicant: Rokko Systems Pte LtdInventors: Yun Suk SHIN, Jong Jae JUNG, Deok Chun JANG
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Publication number: 20150170944Abstract: A picker station for receiving a frame of IC units, the picker station comprising: a unit picker assembly; a selectively movable ejector, arranged to be positioned beneath said frame, said ejector having two or more reciprocally movable ejector pins; wherein said ejector pins are arranged to simultaneously contact and lift two or more IC units out of said frame, with the unit picker assembly arranged to engage said two or more IC units on said ejector pins.Type: ApplicationFiled: July 18, 2013Publication date: June 18, 2015Applicant: Rokko Systems Pte Ltd.Inventor: Jong Jae Jung
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Patent number: 8997592Abstract: A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.Type: GrantFiled: December 23, 2010Date of Patent: April 7, 2015Assignee: Rokko Systems Pte LtdInventors: Hae Choon Yang, Jong Jae Jung, Deok Chun Jang, Chong Chen Gary Lim
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Patent number: 8890018Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.Type: GrantFiled: November 30, 2010Date of Patent: November 18, 2014Assignee: Rokko Systems Pte Ltd.Inventors: Jong Jae Jung, Yun Suk Shin, Hae Choon Yang, Deok Chun Jang
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Publication number: 20130344629Abstract: A method of processing IC units comprising the steps of: dicing said IC units from a substrate; delivering said IC units to a idle block; inspecting a face of said units as exposed during the dicing step using an inspection device whilst said units are on said idle block, then; engaging said units with a picker assembly; passing said units over a second inspection device to inspect an opposed face of said units.Type: ApplicationFiled: March 2, 2012Publication date: December 26, 2013Applicant: ROKKO SYSTEMS PTE LTDInventors: Seung Ho Baek, Jong Jae Jung, Tae Jin Kim
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Publication number: 20130008836Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.Type: ApplicationFiled: November 30, 2010Publication date: January 10, 2013Applicant: ROKKO SYSTEMS PTE LTDInventors: Jong Jae Jung, Yun Suk Shin, Hae Choon Yang, Deok Chun Jang
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Publication number: 20120260752Abstract: A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.Type: ApplicationFiled: December 23, 2010Publication date: October 18, 2012Applicant: ROKKO SYSTEMS PTE LTDInventors: Hae Choon Yang, Jong Jae Jung, Deck Chun Jang, Chong Chen Gary Lim
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Patent number: 7939374Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).Type: GrantFiled: September 30, 2010Date of Patent: May 10, 2011Assignee: Rokko Systems Pte Ltd.Inventor: Hae Choon Yang
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Patent number: 7829383Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).Type: GrantFiled: August 23, 2005Date of Patent: November 9, 2010Assignee: Rokko Systems Pte Ltd.Inventor: Hae Choon Yang
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Patent number: 7540503Abstract: A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).Type: GrantFiled: July 19, 2005Date of Patent: June 2, 2009Assignee: Rokko Systems Pte Ltd.Inventor: Hae Choon Yang