Abstract: In a solid-state image pickup device according to this invention, because a photodiode 2 has a side close to a transfer transistor 3 is longer than an opposite side of the photodiode 2, the transfer transistor 3 can be increased in width. Therefore, it is possible to miniaturize the size of a pixel without causing deterioration in reading property. As a result, this invention can provide the solid-state image pickup device that achieves further miniaturization of pixels by applying an efficient layout of the pixels.

Abstract: A solid-state image pickup device includes a pixel array having a plurality of photodiodes that are disposed in a matrix, electric charge transfer gates, and a floating diffusion (FD), and further includes a reset transistor and an amplifier transistor each shared by the four adjacent photodiodes. In the solid-state image pickup device, the photodiodes include first to fourth photodiodes. In a state where the amplifier transistor is activated, electric charge transfer gates connected respectively to the first to fourth photodiodes are sequentially turned ON and electric charges accumulated in the photodiodes are sequentially read out through the FD. Accordingly, a readout blanking period can be minimized to and signal charges can be read out at high speed. Moreover, readout signal lines need only to be provided for every two columns of the photodiodes, so that openings of the photodiodes can be increased in size.

Abstract: A solid state imaging device includes shared amplification transistors and reset transistors arranged, for example, in a checkered pattern so that centroid of photo diodes 2 of the same colors are arranged substantially at an identical pitch. As a result, the resolution of the solid state imaging device can be maintained without considering irregularities of the incident light for each unit pixel.

Abstract: A solid-state image pickup device includes a pixel array having a plurality of photodiodes that are disposed in a matrix, electric charge transfer gates, and a floating diffusion (FD), and further includes a reset transistor and an amplifier transistor each shared by the four adjacent photodiodes. In the solid-state image pickup device, the photodiodes include first to fourth photodiodes. In a state where the amplifier transistor is activated, electric charge transfer gates connected respectively to the first to fourth photodiodes are sequentially turned ON and electric charges accumulated in the photodiodes are sequentially read out through the FD. Accordingly, a readout blanking period can be minimized to and signal charges can be read out at high speed. Moreover, readout signal lines need only to be provided for every two columns of the photodiodes, so that openings of the photodiodes can be increased in size.

Abstract: In a solid-state image pickup device according to this invention, because a photodiode 2 has a side close to a transfer transistor 3 is longer than an opposite side of the photodiode 2, the transfer transistor 3 can be increased in width. Therefore, it is possible to miniaturize the size of a pixel without causing deterioration in reading property. As a result, this invention can provide the solid-state image pickup device that achieves further miniaturization of pixels by applying an efficient layout of the pixels.

Abstract: A solid-state imaging device includes pixels arranged in a matrix on a semiconductor substrate, the pixels each including: a photodiode for photoelectric-converting an incident light beam; a readout transistor for reading out a signal charge from the photodiode; and a floating diffusion region for converting the read out signal charge into a voltage, wherein the semiconductor substrate is of an n-type, a first p-type well is provided below an n-type forming layer of the photodiode so as to be located at a distant position from a surface of the n-type substrate at the photodiode side, and partially or entirely below the readout transistor, the first p-type well is formed so as to reach the surface of the semiconductor substrate.

Abstract: A solid-state imaging device according to the present invention comprises: a region (hereinafter, referred to as a pixel cell 100) in which at least a photodiode 101 for performing photoelectric conversion, a readout MOS transistor 102 for reading out from the photodiode 101 an electric charge photoelectrically converted, and a floating diffusion 103 for reading out and storing the electric charge via the readout MOS transistor 102 from the photodiode are arranged; and a region (hereinafter, referred to as a transistor cell 106) which includes an amplifier MOS transistor 105 having a plurality of two or more said pixel cells 100 connected thereto and a reset MOS transistor 104 for resetting a potential of the floating diffusion 103 so as to be a potential the same as a potential of a power source and in which at least the reset MOS transistor 104 and the amplifier MOS transistors 105 are arranged, and the pixel cell 100 and the transistor cell 106 are two-dimensionally arranged.

Abstract: A solid state imaging device includes shared amplification transistors and reset transistors arranged, for example, in a checkered pattern so that centroid of photo diodes 2 of the same colors are arranged substantially at an identical pitch. As a result, the resolution of the solid state imaging device can be maintained without considering irregularities of the incident light for each unit pixel.