Abstract: An apparatus for trimming the wire leads of electronic components mounted on printed circuit boards is provided, which comprises a base plate, an adjustable holding fixture for a printed circuit board fixedly disposed on the base plate, a pivotable cantilevered bracket assembly mounted on the base plate adjacent the holding fixture, a motor-driven rotary cutting blade disposed on the end of the cantilevered pivotally movable bracket assembly for movement along the surface of a printed circuit board disposed within the holding fixture, and an anti-warp device including one or more pivotable lever arms disposed above and below the printed circuit board, and an adjustable pin mounted on each of the upper lever arm to engage the top surface of said printed circuit board and urge the same into a flattened position and an adjustable pin disposed in each of the lower lever arms to engage the bottom surface of said printed circuit board to urge the same in a flattened position.

Abstract: A chute for feeding electronic components having axial wire leads into a machine for cutting and forming said leads includes spaced apart parallel plates defining therebetween a chamber for the bodies of the electronic components and has an elongated slot in each plate for receiving and guiding the axial wire leads thereof. The width of the slots and the distance between the plates are adjustable to accommodate components having varying body lengths and varying wire diameters. Wire retainers are also included to stop each component at the bottom of the chute and guide it into a position to be received and retained by the cutting and forming machine.