Abstract: A system for cooling a circuit component on an electronic device includes a closed-loop cooling circuit and a coolant filling device. The closed-loop cooling circuit includes a coolant block, a first pump and a radiator. The coolant filling device includes a container, a base and a second pump disposed inside the base. The coolant filling device is configured for attachment to the cooling circuit. In some embodiments, when the coolant filling device is attached to the cooling circuit, coolant may be circulated from the coolant filling device to the cooling circuit while the cooling circuit circulates coolant. In further embodiments, when the coolant filling device is attached to the cooling circuit, coolant may be circulated from the coolant filling device to the cooling circuit while the electronic device remains powered on.

Abstract: A pump driven coolant filling device and corresponding methods are configured for adding liquid coolant to a coolant circuit for removing heat. The device and methods may be used with liquid coolant circuits on electronic components, or in other industries that utilize liquid coolant. The device includes a base having an integrated pump for circulating coolant to the cooling circuit. A disposable container of coolant may be attached to the base using a threaded connection. The device includes a handle with a switch for controlling operation of the pump in some embodiments. A coolant circuit includes quick connect couplings configured for attachment to corresponding hoses extending from the base. During use, a cooling circuit may continue operation while adding coolant to the cooling circuit using the device.

Abstract: An integrated cooling system for actively cooling one or more electronic components in an electronic device such as a computer is provided. The cooling system includes a radiator and a pump integrally attached to the radiator. The pump can include a pump housing having an upper pump housing member attached to the radiator and a lower pump housing member detachably securable to the upper pump housing member. The cooling system includes a flow inlet and a flow outlet for attaching hoses or conduits to the radiator for actively moving a liquid coolant to and from an external cooling block or cooling plate. The external cooling block or cooling plate can be attached to the electronic component to be cooled, such as a computer graphics card, microprocessor or other circuit component.

Abstract: A heat dissipating device for cooling an electrical component is disclosed that includes a heat sink base. A plurality of helicoid pins is fixed to the heat sink base and extends therefrom. In one preferred embodiment, the helicoid pins have a diameter of about 0.05 inches to 0.15 inches, about 25-35 turns per inch, and a thread depth of about 0.005 and 0.02 inches. The helicoid pins provide an uneven cooling surface and an increased cooling surface area that increase the heat dissipation capability of the heat dissipating device, when compared to straight pins having the same diameter.