Abstract: There is provided a device (1) for surface mounting that has a substrate (10) and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate (10) and the capacitor element using a packaging resin. The substrate (10) includes a first terminal electrode (51) electrically connected to a first electrode of the capacitor element and a second terminal electrode (52) electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface (12) on an opposite side to the loading-side surface of the substrate (10) is exposed on a mounting surface (2) of the device (1), and the first terminal electrode (51) and the second terminal electrode (52) are adjacently disposed around an entire circumference of the mounting surface (2) of the device (1).

Abstract: There is provided a device (1) for surface mounting that has a substrate (10) and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate (10) and the capacitor element using a packaging resin. The substrate (10) includes a first terminal electrode (51) electrically connected to a first electrode of the capacitor element and a second terminal electrode (52) electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface (12) on an opposite side to the loading-side surface of the substrate (10) is exposed on a mounting surface (2) of the device (1), and the first terminal electrode (51) and the second terminal electrode (52) are adjacently disposed around an entire circumference of the mounting surface (2) of the device (1).

Abstract: There is provided a device for surface mounting that has a substrate and a capacitor element loaded on a loading-side surface of the substrate and is integrally molded including the substrate and the capacitor element using a packaging resin. The substrate includes a first terminal electrode electrically connected to a first electrode of the capacitor element and a second terminal electrode electrically connected to a second electrode of the capacitor element, at least part of a mounting-side surface on an opposite side to the loading-side surface of the substrate is exposed on a mounting surface of the device, and the first terminal electrode and the second terminal electrode are adjacently disposed around an entire circumference of the mounting surface of the device.