Patents Assigned to Ryoden Kasei Co., Ltd.
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Patent number: 8912274Abstract: To obtain water-dispersible varnish used in an alternative refrigerant/refrigerating machine oil refrigerant system or a natural refrigerant/refrigerating machine oil refrigerant system, the water-dispersible varnish being capable of solving two problems, namely, reducing the volatile components and the like during thermal curing and resistance of the cured varnish to the refrigerant system, wherein the water-dispersible varnish has a specific thermosetting resin as base polymer, a specific vinyl monomer as reactive diluent, organic peroxide as reaction initiator, and water mixed therein.Type: GrantFiled: August 3, 2009Date of Patent: December 16, 2014Assignees: Mitsubishi Electric Corporation, Ryoden Kasei Co., Ltd.Inventors: Shigeyuki Yamamoto, Yoshinori Shirafuji, Toshifumi Kanri, Satoru Toyama, Nobuyuki Kamegawa, Yukio Hidaka
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Patent number: 8235735Abstract: A terminal joining structure includes a terminal having a tubular barrel portion and a flange portion that is integrally formed at the axis-direction end of the barrel portion, a conductor substrate on which is opened a through-hole for inserting the barrel portion, and a ring that fits on the barrel portion on the opposite side of the conductor substrate. On the barrel portion is formed a taper that increases in diameter toward the flange portion. The diameter of the larger-diameter portion of the taper is larger than the inner diameter of the through-hole. The terminal is caulked to cause radially outward expansion of an end part of the barrel portion, which passes through the ring, on the opposite side of the conductor substrate and is fixed to the conductor substrate together with the ring.Type: GrantFiled: January 30, 2008Date of Patent: August 7, 2012Assignees: Mitsubishi Electric Corporation, Ryoden Kasei Co., Ltd.Inventors: Kohei Oka, Shozo Sakaue, Shunichi Kitayama, Yoichi Hisamori, Yoshitaka Ono, Toshikazu Karita, Tetsuya Takahashi
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Publication number: 20120189768Abstract: To obtain water-dispersible varnish used in an alternative refrigerant/refrigerating machine oil refrigerant system or a natural refrigerant/refrigerating machine oil refrigerant system, the water-dispersible varnish being capable of solving two problems, namely, reducing the volatile components and the like during thermal curing and resistance of the cured varnish to the refrigerant system. Water-dispersible varnish having a specific thermosetting resin as base polymer, a specific vinyl monomer as reactive diluent, organic peroxide as reaction initiator, and water mixed therein.Type: ApplicationFiled: August 3, 2009Publication date: July 26, 2012Applicants: Ryoden Kasei Co., Ltd., Mitsubishi Electric CorporationInventors: Shigeyuki Yamamoto, Yoshinori Shirafuji, Toshifumi Kanri, Satoru Toyama, Nobuyuki Kamegawa, Yukio Hidaka
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Publication number: 20110003519Abstract: A terminal joining structure includes a terminal having a tubular barrel portion and a flange portion that is integrally formed at the axis-direction end of the barrel portion, a conductor substrate on which is opened a through-hole for inserting the barrel portion, and a ring that fits on the barrel portion on the opposite side of the conductor substrate. On the barrel portion is formed a taper that increases in diameter toward the flange portion. The diameter of the larger-diameter portion of the taper is larger than the inner diameter of the through-hole. The terminal is caulked to cause radially outward expansion of an end part of the barrel portion, which passes through the ring, on the opposite side of the conductor substrate and is fixed to the conductor substrate together with the ring.Type: ApplicationFiled: January 30, 2008Publication date: January 6, 2011Applicants: Mitsubishi Electric Corporation, Ryoden Kasei Co., Ltd.Inventors: Kohei Oka, Shozo Sakaue, Shunichi Kitayama, Yoichi Hisamori, Yoshitaka Ono, Toshikazu Karita, Tetsuya Takahashi
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Publication number: 20080246354Abstract: A stator coil 24 is installed in a stator core 11, and an insulating resin is impregnated into slot portions 22 and hardened. The stator coil 24 is constituted by enameled wires in which a polyamideimide resin layer has been applied radially outside a copper wire and hardened, and the insulating resin contains as a major component a THEIC-modified polyester resin that has been modified by a fatty acid.Type: ApplicationFiled: August 30, 2007Publication date: October 9, 2008Applicants: MITSUBISHI ELECTRIC CORPORATION, RYODEN KASEI CO., LTD.Inventors: Yoshihito ASAO, Hiroki KATAYAMA, Hitoshi TOKUYAMA, Tomotaka MAKINO
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Patent number: 5327010Abstract: An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.Type: GrantFiled: July 17, 1990Date of Patent: July 5, 1994Assignees: Ryoden Kasei Co., Ltd., Mitsubishi Denki Kabushiki KaishaInventors: Takeshi Uenaka, Jun Ohbuchi, Shigeo Onoda, Makoto Omori, Hajime Maeda, Toru Tachikawa
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Patent number: 5038250Abstract: An IC card of the present invention comprises a panel having resilient projections and a frame having recesses corresponding to the resilient projections, and the panel is mounted on the frame by engaging the respective resilient projections with the respective recesses. Thus, the panel can be securely attached to the panel.Type: GrantFiled: August 7, 1990Date of Patent: August 6, 1991Assignees: Ryoden Kasei Co. Ltd., Mitsubishi Denki Kabushiki KaishaInventors: Takeshi Uenaka, Jun Ohbuchi
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Patent number: 4889749Abstract: An identification card comprises a center core layer, a photograph embedded in the core layer, a first assembly of multiple layers laminated on the upper surface of the core layer and the photograph, and a second assembly of multiple layers laminated on the back surface of the core layer and the photograph. The layers of the first and second assemblies have substantially similar thermal expansion properties. Accordingly, the thickness of the identification card is uniform since the thickness of the core layer is substantially the same as the thickness of the photograph. High reliability can be obtained without any accompanying warp as a result of the substantially symmetrical arrangement of the first and second assemblies with respect to the core layer and the embedded photograph.Type: GrantFiled: November 24, 1987Date of Patent: December 26, 1989Assignees: Ryoden Kasei Co., Ltd., Mitsubishi Denki Kabushiki KaishaInventors: Masato Ohashi, Shiyoojiro Kodai
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Patent number: 4879153Abstract: An IC card has a laminated card body in which an IC module is housed. The card body is formed by lamination of a plurality of sheets, at least the sheet which contacts the bottom surface of the IC module being made of a synthetic paper having good flexing resistance. The remaining sheets are made of a rigid polyvinyl chloride. The card body is formed by conventional laminating processes.Type: GrantFiled: September 8, 1988Date of Patent: November 7, 1989Assignees: Ryoden Kasei Co., Ltd., Mitsubishi Denki Kabushiki KaishaInventors: Masato Ohashi, Shiyojiro Kodai