Patents Assigned to Ryoko Chemical Co., Ltd.
  • Method of treating wiring substrate and wiring substrate manufactured by the same
    Patent number: 9301399
    Abstract: A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: March 29, 2016
    Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., RYOKO CHEMICAL CO., LTD.
    Inventors: Tomoko Suzuki, Norihumi Tashiro, Yukihide Naito, Akari Hitotsugo
  • METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED BY THE SAME
    Publication number: 20140311778
    Abstract: A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 23, 2014
    Applicants: Mitsubishi Gas Chemical Company, Inc., Ryoko Chemical Co., Ltd.
    Inventors: Tomoko SUZUKI, Norihumi TASHIRO, Yukihide NAITO, Akari HITOTSUGO