Abstract: Device for fluidic support and bi-directional rotation of an item in a process chamber where the operating fluid is compatible with the process. The device has a rotable load bearing platform with a load bearing interface between it and a base in the chamber. Fluid, which may be supercritical fluid, is applied through load bearing ports into the interface to fluidly support the weight and create rotational forces on the load platform. A turbine on the load platform is actuated by fluid flow directed from turbine ports in the chamber connected to the fluid source. Markers on the load platform and sensors in the chamber provide speed and direction sensing. An electromagnetic source in the chamber reacts with a permanent magnet in the rotable platform to provide an electromagnetic force for moving, or changing or holding the relative position of the load platform.

Abstract: A supercritical fluid cleaning system and method comprising mainly a pressure chamber, a closable lid, a substrate support for holding at least one substrate, a rotable shaft extending outward from within the chamber, an external rotary power source coupled magnetically or otherwise to the shaft, and a rotable component or impeller attached to the chamber end of the shaft in close proximity to the substrate holding position, and baffles located close to the rotable component. The rotable component is con|figured for rotation within the supercritical phase fluid in the chamber close to the surface of the wafer for causing agitation and turbulent fluid flow against the surface of the substrate, and increased intra-chamber fluid circulation.

Abstract: A method is disclosed for the introduction of at least one additive to a processes chamber, that method comprising: supplying a process fluid to the process chamber; introducing at least one co-solvent to the process fluid thereby forming a mixture of process fluid and co-solvent without the additive; allowing a concentration of the co-solvent relative to the process fluid at least within the process chamber to reach a level at which the sparingly soluble additive is soluble; adding a solution of the additive to the mixture of the process fluid and the co-solvent, and processing a workpiece in the fluid.

Abstract: A continuous flow, steady state fluid delivery and recovery system for a process chamber and processes requiring supercritical fluid and desired additives including co-solvents, for conducting repetitive batch processing operations in an automated environment, for such processes as supercritical carbon dioxide cleaning and processing of semiconductor wafers. The system provides for steady-state operation of fluid flow and byproducts recovery while the process chamber is brought rapidly and repeatedly on and off line as in batch operations and for various process steps.

Abstract: A dry process for the cleaning of precision surfaces such as of semiconductor wafers, by using process materials such as carbon dioxide and useful additives such as cosolvents and surfactants, where the process materials are applied exclusively in gaseous and supercritical states. Soak and agitation steps are applied to the wafer, including a rapid decompression of the process chamber after a soak period at higher supercritical pressure, to mechanically weaken break up the polymers and other materials sought to be removed, combined with a supercritical fluid flush to carry away the loose debris.

Abstract: A pressure vessel for use in production processes requiring elevating and ranging of temperatures and pressures during the process cycle, readily adaptable to production line operation, suitable for wafer processing in the semiconductor industry and for other industries and processes. The pressure vessel is configured within an open support frame with a stationary, preferably inverted, orientation. The cover or closing plate is vertically movable towards the mouth of the pressure vessel and functions as the platform by which the object under process is transferred into the vessel. The moving and locking mechanism for the cover is isolated and shielded from the process environment.

Abstract: An inverted pressure vessel system for conducting automated industrial processes requiring elevated pressure and temperatures has a vertically movable pedestal for opening and closing the underside loading port, with pedestal drive system and locking mechanism located below the pedestal top and isolated from the chamber opening. The chamber is connectible to a pressure control and process fluid supply system, and has heat exchangers connected to an external source for temperature control. Process fluids are distributed across a central process cavity through divergent inflow and convergent outflow process fluid channels.

Abstract: A method and apparatus for fabricating and drying wafers, including micro-electro-mechanical system (MEMS) structures, in a second, supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel connected to a supercritical processing fluid supply and recover system, with an internal heat exchanger connected to external heating and cooling sources, which is closed with a vertically movable base plate. A wafer cassette configured for supporting multiple wafers is submerged in a first processing fluid within a container, which is installed on the base plate for insertion into the pressure vessel. Vessel inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to nearly the base plate. Container inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to inside the container and nearly to the bottom of the container.