Abstract: A method of selective plating a component, which method comprises contacting a lower face of the component with a contoured lower mask having a plating aperture so as to expose an area of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, wherein the cross-sectional area of the plating aperture is enlarged at the surface of the component so as to define one or more cavities in which the plating rate is lower than elsewhere in the plating aperture.

Abstract: A method of selective plating a component, which method includes contacting upper and lower faces of the component with upper and lower masks, respectively, so that the lower mask exposes a part of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, the plating pressure and the hardness of the material of the upper mask being such that the upper mask is deformed during plating so as at least partially to mask the edge(s) of the exposed part.

Abstract: There is provided, in a method of selective electroplating, the improvement comprising the utilization of a highly conductive electrolyte, compatible with the plating electrolyte but containing no depositable metallic ions, to form the cathode connection to the components to be plated and, in a machine for electroplating components, the improvement comprising providing the cathode connection to the components to be plated through the intermediary of a highly conductive electrolyte compatible with the plating electrolyte but containing no depositable metallic ions.