Abstract: The invention relates to a method for producing a semiconductor structure comprising a superficial layer, at least one embedded layer, and a support, which method comprises: a step of forming, on a first support, patterns in a first material, a step of forming a semiconductor layer, between and on said patterns, a step of assembling said semiconductor layer with a second support.
Type:
Grant
Filed:
March 24, 2010
Date of Patent:
October 25, 2011
Assignee:
S.O.I.TEC Solicon On Insulator Technologies
Inventors:
Bernard Aspar, Chrystelle Lagahe-Blanchard