Patents Assigned to S & S Technologies
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Patent number: 6933448Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 ?m˜10 ?m and an optimum thickness ranging between 2 ?m˜200 ?m.Type: GrantFiled: January 16, 2004Date of Patent: August 23, 2005Assignee: S & S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Publication number: 20040202834Abstract: A resin-coated carrier having a sheet-like base, the sheet-like base corresponding to the shape of a PC board substrate on a relatively smaller scale, and a resin of a predetermined thickness covered over one side of the sheet-like base for bonding to a PC board substrate for making a PC board without causing an overflow of the resin.Type: ApplicationFiled: September 19, 2002Publication date: October 14, 2004Applicant: S & S Technology Corp.Inventors: Ching-I Yu, Lang-Ching Chih, Kang-Tsun Liu, Kung-Ming Yen
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Publication number: 20040172818Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.Type: ApplicationFiled: March 16, 2004Publication date: September 9, 2004Applicant: S & S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Publication number: 20040149681Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.Type: ApplicationFiled: January 16, 2004Publication date: August 5, 2004Applicant: S & S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Publication number: 20040047991Abstract: A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.Type: ApplicationFiled: September 11, 2002Publication date: March 11, 2004Applicant: S & S Technology Corp.Inventors: Ching-I Yu, Lang-Ching Chih, Kang-Tsun Liu, Kung-Ming Yen
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Publication number: 20040007386Abstract: A printed circuit board comprises a substrate with a conductor pattern thereon. The conductor pattern is composed of a plurality of traces in a specific layout. The conductor pattern has first sections where adapt to let current flowing through and second sections electrically connected with the first sections respectively. The first sections of the conductor pattern have plating portions for providing connecting layers thereon, and a solder mask is provided on the substrate. The solder mask shelters the conductor pattern but exposes the connecting layers on the plating portions of the first sections of the conductor pattern. The solder mask has apertures at where relate to the second sections of the conductor pattern.Type: ApplicationFiled: July 11, 2002Publication date: January 15, 2004Applicant: S & S Technology CorporationInventors: Ching-Hua Tsou, Chong-Ren Maa, Wan-Kuo Chih
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Publication number: 20030070835Abstract: A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.Type: ApplicationFiled: May 24, 2002Publication date: April 17, 2003Applicant: S&S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Publication number: 20030071013Abstract: A PC board micro hole processing method using plasma technique to etch the substrate of the PC board, and then using chemical etching technique to remove residual material such as glass fibers.Type: ApplicationFiled: October 16, 2001Publication date: April 17, 2003Applicant: S & S TECHNOLOGY CORPORATIONInventors: Ching-Hua Tsao, Jou-Yuan Tseng, Kang-Tsun Liu
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Publication number: 20030071014Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.Type: ApplicationFiled: May 28, 2002Publication date: April 17, 2003Applicant: S&S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Publication number: 20030072927Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.Type: ApplicationFiled: May 28, 2002Publication date: April 17, 2003Applicant: S&S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Patent number: 6395625Abstract: A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method comprises the steps of: a) disposing a layer of semi-solid solder mask material having an expansion coefficient substantially the same as that of the substrate on the surface of said substrate to cover said copper conductor pattern, and a metal foil covering the material layer; b) applying pressure to the metal foil and applying baking treatment to cure the solder mask material in to solid; c) utilizing chemical solution and plasma etching to remove the metal foil and the solid solder mask material above the unsheltered portion of said copper conductor pattern respectively such that the unsheltered portion can be exposed; and d) using chemical solution to remove the residual metal foil.Type: GrantFiled: October 12, 2001Date of Patent: May 28, 2002Assignee: S & S Technology CorporationInventors: Chong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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Patent number: 5038616Abstract: A nonintrusive method for determining the magnitudes and spatial and temporal origins of individual dynamic (time varying) torsion loads acting in superposition on a rotating shaft or system of shafts includes combining the measurements of said shaft's inertial response to the dynamic torsion loads with the measurements of discrete relative angular displacement parameters at causally connected space-time points. Changes in the shaft's characteristics, such as those due to change in its temperature or degradation of its structural integrity, can be monitored to provide updated torque determinations that maintain accuracy by taking these changes into account and to provide information on the onset and location of shaft fractures. Apparatus based on the method of this invention is self calibrating.Type: GrantFiled: November 2, 1989Date of Patent: August 13, 1991Assignee: S & S TechnologiesInventors: Stanley Schneider, Richard Spitzer