Abstract: There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.
Type:
Grant
Filed:
November 10, 2014
Date of Patent:
March 6, 2018
Assignee:
SAEDGE VISION SOLUTIONS PTE. LTD.
Inventors:
Ah Kow Chin, Choong Fatt Ho, Victor Vertoprakhov, Soon Wei Wong
Abstract: There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.
Type:
Application
Filed:
November 10, 2014
Publication date:
September 1, 2016
Applicant:
SAEDGE VISION SOLUTIONS PTE LTD
Inventors:
Ah Kow CHIN, Choong Fatt HO, Victor VERTOPRAKHOV, Soon Wei WONG