Patents Assigned to Saehan Industries Corporation
  • Polyimide for high temperature adhesive
    Patent number: 6307008
    Abstract: A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: October 23, 2001
    Assignee: Saehan Industries Corporation
    Inventors: Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang, Jeong Min Kweon