Abstract: Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.
Type:
Grant
Filed:
May 7, 2018
Date of Patent:
November 2, 2021
Assignee:
SAFRAN COLIBRYS SA
Inventors:
Stephan Gonseth, Raphael Brisson, Jacques Moser
Abstract: Accelerometer including a seismic mass in a plane and a first capacitor plate and a second capacitor plate arranged parallel to the plane. The seismic mass is arranged in between the first capacitor plate and the second capacitor plate. The first capacitor plate and the second capacitor plate are configured to detect movements of the seismic mass out of the plane. A pillar extending from the first capacitor plate to the second capacitor plate through a cut-out in the seismic mass for stiffening the accelerometer.
Type:
Grant
Filed:
December 11, 2017
Date of Patent:
March 24, 2020
Assignee:
SAFRAN COLIBRYS SA
Inventors:
Pascal Zwahlen, Sophie Birling, Bertrand Dutoit