Abstract: Disclosed is a one step fiber optic connector polishing method. The method is a sequence of processes that may include severing a fiber (100) length projecting out of the end face (106) of a ferrule (102) having a pre-shaped surface, such that the residual fiber length does not exceed 80 microns. Cleaning ferrule (102) end face (106) such that no residual debris are left on it. Polishing fiber end-face (140) only, on a finishing polishing film (180) until fiber end-face (140) and ferrule end-face (106) are in a relation that ensures the desired fiber undercut or protrusion.

Abstract: A precision polishing system able to polish samples to an accuracy within the submicron range is disclosed. The novel polishing system has applications in the semiconductor field for use in polishing silicon wafers during testing and quality control inspections. In the examination of failed wafers during the semiconductor manufacturing process, it is desirable to examine a cross section of the wafer at the point of failure. The polishing system of the present invention enables very accurate polishing of the wafer down to the submicron accuracy range. The sample is held is place by a gripper assembly which is attached to a polishing arm slideably connected to a fixed rail. The polishing arm is raised and lowered to polish the sample using a polishing wheel covered with a suitable abrasive. A video microscope attached to an object lens and a video camera provide images that are processed to control the polishing operation.