Abstract: An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit.

Abstract: An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit.

Abstract: A substrate surface detection unit performs image analysis of cross-sectional images of an object to be inspected including a substrate and an electronic component and specifies a surface image on which the surface of the substrate is photographed. A pseudo cross-sectional image creation unit specifies a region of the solder for joining the substrate and the electronic component, the solder being photographed on the cross-sectional images, and creates a pseudo cross-sectional image in which an imaged region is made to have a thickness in a pseudo manner by piling up the cross-sectional images on which the solder is photographed. An inspection unit estimates whether the joint state of the solder is good or bad by performing image analysis on the region of the solder photographed on the surface image and the pseudo cross-sectional image.

Abstract: An appearance inspection apparatus for inspecting a board is provided with multiple imaging units for capturing respective images of the board. Multiple slave personal computers respectively provided for the multiple imaging units inspect the board by referring to data of images of the board captured by the respective imaging units. Each of the multiple slave personal computers transmits, to other slave personal computers, shared data that are necessary for inspection by other slave personal computers. The shared data is acquired by each of the slave personal computers from data of an image of the inspection piece captured by an associated imaging unit. Each of the slave personal computers inspects an appearance of the board by referring to the shared data received from another slave personal computer.

Abstract: A first imaging unit and a second imaging unit of an appearance inspection apparatus for inspecting a board scan one surface of the board by being moved relative to the board. A third imaging unit and a fourth imaging unit are provided opposite to the first imaging unit and the second imaging unit, sandwiching the board, and scan the other surface of the board by being moved relative to the board. A board transport motor moves the imaging units and the board relative to each other. Each of the imaging units completes scanning the board in a single step of movement for moving the board and the scanning units relative to each other.

Abstract: The present invention is an appearance inspection apparatus and method utilizing multiple light sources in a lighting unit 30 to alternately irradiate, line by line, side light from a side light source and slit light from a slit light source onto board 1 to be inspected. A correction value memory unit stores digital correction values required for correcting shadings for the side light source and the slit light source and an analysis unit utilizes these digital correction values to correct shadings on the image data. A highly accurate image is thus obtained.

Abstract: An appearance inspection apparatus and method using at least one telecentric lens, although at least two is preferred and at least a corresponding number of line sensors arranged in parallel with the image capture direction for inspecting a large circuit board. When two lenses are used two images are formed, which partially overlap each other. If image data for one line is captured in this state, a scanning head having two sets of telecentric optical systems move one line at a time in the driving direction. By repeating the same steps, data for two image segments which partially overlap throughout the entire line of board are obtained. The two image segments are synthesized after displacement of positions when colors in the overlapping portion of the two pieces of images are corrected. Inspection of board is then performed based on the combined image.

Abstract: An appearance inspection apparatus for inspecting a surface of a printed circuit board requires high inspection accuracy and inspection time reduction. To this end, the apparatus has a scan head that scans an object under inspection and generates image data of the surface of the object. The scan head includes a vertical light source which projects light on the surface from right above the object and a side light source which projects light sidelong on the surface. A lenticular sheet is provided between the vertical light source and the object in order to adjust the vertical light and improve the inspection accuracy in a vertical light test. In a side light test, light sources other than the central part in the vertical light source is turned on and an auxiliary light is projected along with the side light, so that the dynamic range for the inspection can increase.