Abstract: A stacking arrangement for combining a plurality of discrete interconnected electronic modules in aligned stacked relation includes a plurality of modules having discrete three-dimensional housing enclosures. Integral cooperating pin and socket electrical connector units are mounted in the top and bottom panels for interconnecting respective facing panels of juxtaposed modules electrically to interconnect all stacked modules in a manner not externally visible. An integral intermodular ventilation system is provided that has matching openings in corresponding facing top and bottom surfaces of the modules in aligned relation to accommodate continuous vertical intermodular air flow and includes one or more fans for pressurizing the stack and impelling air to flow through the stacked modular arrangement. A cover mounts on top of the ultimate functional module covering the pin and socket connecting unit of the top module and contains a plurality of side openings to accommodate outward ventilation flow.