Abstract: Radio Frequency (RF) amplifier circuits are disclosed which may exhibit improved video/instantaneous bandwidth performance compared to conventional circuits. For example, disclosed RF amplifier circuits employ various concepts for reducing an overall circuit inductance or enabling an increase in capacitance for a given circuit size.
Abstract: The invention refers to method for packaging an integrated circuit (IC) comprising steps of: attaching at least one die on a substrate; attaching bond-wires from the die(s) to package terminal pads; mold or dispense a thermo-degradable material on the substrate, die(s) and bond-wires; mold an encapsulant material; decompose the thermo-degradable materials by temperature treatment.