Patents Assigned to Samco Inc.
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Patent number: 11650178Abstract: A method for bonding a first member having a first bond-target surface made of cycloolefin polymer to a second member having a second bond-target surface made of metal. The method includes a process of exposing the first bond-target surface and the second bond-target surface to at least one of the H2O plasma and O2 plasma, as well as a process of combining the first bond-target surface and the second bond-target surface.Type: GrantFiled: December 10, 2018Date of Patent: May 16, 2023Assignee: SAMCO INC.Inventors: Risa Funahashi, Taichi Hashimoto, Hirokazu Terai, Fumina Miyake
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Patent number: 11633924Abstract: A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.Type: GrantFiled: February 8, 2018Date of Patent: April 25, 2023Assignee: SAMCO INC.Inventors: Hirokazu Terai, Risa Funahashi, Tomoyasu Nishimiya
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Publication number: 20200386707Abstract: A method for bonding a first member having a first bond-target surface made of cycloolefin polymer to a second member having a second bond-target surface made of metal. The method includes a process of exposing the first bond-target surface and the second bond-target surface to at least one of the H2O plasma and O2 plasma, as well as a process of combining the first bond-target surface and the second bond-target surface.Type: ApplicationFiled: December 10, 2018Publication date: December 10, 2020Applicant: SAMCO INC.Inventors: Risa FUNAHASHI, Taichi HASHIMOTO, Hirokazu TERAI, Fumina MIYAKE
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Publication number: 20190381744Abstract: A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.Type: ApplicationFiled: February 8, 2018Publication date: December 19, 2019Applicant: SAMCO INC.Inventors: Hirokazu TERAI, Risa FUNAHASHI, Tomoyasu NISHIMIYA
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Publication number: 20180301368Abstract: A wafer processing device is a device for handling a framed wafer including a frame, a film stretched inside the frame, and a wafer attached on the film, to perform a plasma processing on the wafer. The device includes: a wafer stage on which the wafer is to be placed via the film; a plurality of vertically movable frame-lifting pins arranged around the wafer stage, for supporting the frame; and a frame-lifting-pin drive controller for lowering the individual frame-lifting pins with different timings. With this device, the film with the attached wafer can be neatly placed on the wafer stage (i.e. with no wrinkle in the film as well as no bubble between the film and the wafer stage).Type: ApplicationFiled: March 15, 2018Publication date: October 18, 2018Applicant: SAMCO INC.Inventors: Tomoyuki NONAKA, Akimi UCHIDA
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Patent number: 9488519Abstract: The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument 1 includes an optical axis tilting mechanism 13 that includes a first tilting mechanism 131 and a second tilting mechanism 132. From the optical axis A1 of irradiation light beam emitted from a light beam source 112, the first tilting mechanism 131 tilts the optical axis A1 about the first tilting axis T1. The second tilting mechanism 132 tilts the optical axis A1 about the second tilting axis T2. The light beam measuring instrument 1 can receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanism 13 even if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.Type: GrantFiled: June 4, 2015Date of Patent: November 8, 2016Assignee: SAMCO INC.Inventors: Kiyoshi Hasegawa, Hiroshi Kawamura, Peter Wood
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Patent number: 8314560Abstract: An induction coil composed of n pieces of identically shaped coil elements (where n is equal to or greater than two), which are rotation-symmetrically arranged with respect to an axis normal to the surface of an object to be processed, is provided above the object, the coil elements being electrically connected in parallel. Each of the coil elements of the induction coil encircles the aforementioned axis, with the ground end and the feed end located at the same position on a projection plane on the object with the ground end under the feed end. Each coil element has a bottom portion shaped like an arc having a predetermined width and a central angle of 360°/n, with the ground end at one end thereof, and a feed portion shaped like an arc having a predetermined width, with the feed end at one end thereof, the feed portion being located above the bottom portion and electrically connected to the same bottom portion.Type: GrantFiled: November 21, 2007Date of Patent: November 20, 2012Assignee: Samco Inc.Inventors: Shinji Nakagami, Hirohiko Nakano
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Publication number: 20100066251Abstract: An induction coil composed of n pieces of identically shaped coil elements (where n is equal to or greater than two), which are rotation-symmetrically arranged with respect to an axis normal to the surface of an object to be processed, is provided above the object, the coil elements being electrically connected in parallel. Each of the coil elements of the induction coil encircles the aforementioned axis, with the ground end and the feed end located at the same position on a projection plane on the object with the ground end under the feed end. Each coil element has a bottom portion shaped like an arc having a predetermined width and a central angle of 360°/n, with the ground end at one end thereof, and a feed portion shaped like an arc having a predetermined width, with the feed end at one end thereof, the feed portion being located above the bottom portion and electrically connected to the same bottom portion.Type: ApplicationFiled: November 21, 2007Publication date: March 18, 2010Applicant: SAMCO INC.Inventors: Shinji Nakagami, Hirohiko Nakano
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Patent number: 6836990Abstract: A preferred handguard for a rifle includes a pair of essentially identical half-grip pieces each having an elongated body with a generally triangular lateral cross-section, including two exterior sides and a mating side. The exterior sides of the triangular cross-section are formed substantially at a right angle to each other. The mating side of the triangular cross-section is centrally hollowed and has outer edges that form a mating surface for mating with the other half-grip piece to enclose an air space surrounding a section of the rifle barrel. Longitudinally extending accessory mounting rails are formed on each of the exterior sides and are recessed in the half-grip piece such that the rails are located inside a laterally extended generally semi-octagonal outline defined by an end wall. Removable elastomeric rail covers that replicate the semi-octagonal outline are provided to form a substantially continuous shape with the end wall.Type: GrantFiled: November 4, 2003Date of Patent: January 4, 2005Assignee: First Samco, Inc.Inventor: Amnon Shiloni
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Patent number: 6609321Abstract: A forearm handgrip for a rifle, comprising a pair of essentially identical semi-oval mating half-grip pieces adapted to mate together to form the grip. The half-grip pieces have an exterior shaped in a generally semi-oval lateral section having curved sides and adapted to fit a shooter' hand, and are formed of injection-molded high density polymer. At least the bottom, and preferably both, half-grip piece have an accessory mounting rail recessed in the area at the center of the piece such that the posts and guide channel of the rail are inside what would be the extended arc of the sides of the half grip piece. A cover plate is adapted for engagement with each rail to cover the rail when the rail is not in use, the cover plate being shaped to replicate the extended arc of the sides of the half grip up to a flat longitudinally extending rib running along the center of the cover plate. Ventilation holes may be located in a row in the accessory rail and in the cover plate.Type: GrantFiled: September 16, 2002Date of Patent: August 26, 2003Assignee: First Samco Inc.Inventor: Tuvia Faifer
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Publication number: 20030074822Abstract: A forearm handgrip for a rifle, comprising a pair of essentially identical semi-oval mating half-grip pieces adapted to mate together to form the grip. The half-grip pieces have an exterior shaped in a generally semi-oval lateral section having curved sides and adapted to fit a shooter' hand, and are formed of injection-molded high density polymer. At least the bottom, and preferably both, half-grip piece have an accessory mounting rail recessed in the area at the center of the piece such that the posts and guide channel of the rail are inside what would be the extended arc of the sides of the half grip piece. A cover plate is adapted for engagement with each rail to cover the rail when the rail is not in use, the cover plate being shaped to replicate the extended arc of the sides of the half grip up to a flat longitudinally extending rib running along the center of the cover plate. Ventilation holes may be located in a row in the accessory rail and in the cover plate.Type: ApplicationFiled: September 16, 2002Publication date: April 24, 2003Applicant: First Samco Inc.Inventor: Tuvia Faifer
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Patent number: D502524Type: GrantFiled: June 17, 2003Date of Patent: March 1, 2005Assignee: First Samco Inc.Inventors: Craig Fisher, Amnon Shiloni
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Patent number: D507619Type: GrantFiled: May 2, 2003Date of Patent: July 19, 2005Assignee: First Samco Inc.Inventor: Amnon Shiloni
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Patent number: D486547Type: GrantFiled: March 14, 2002Date of Patent: February 10, 2004Assignee: First Samco Inc.Inventor: Tuvia Faifer