Abstract: There is provided a method for manufacturing a heat dissipation film. The method includes preparing a first mixture by mixing hexagonal boron nitride and an organic solvent, performing primary surface-modification on the hexagonal boron nitride, adding an amine-based silane compound to the first mixture, and then performing secondary surface-modification on the hexagonal boron nitride, preparing a second mixture by obtaining the secondarily surface-modified hexagonal boron nitride, and mixing the secondarily surface-modified hexagonal boron nitride, an imidazole-based curing agent, and an organic solvent, dispersing the second mixture, adding an epoxy resin to the second mixture, and then performing dispersion, and drying the organic solvent in the second mixture, and manufacturing a film using a product obtained by the drying.

Abstract: There is provided a method for manufacturing a heat dissipation film. The method includes preparing a first mixture by mixing hexagonal boron nitride and an organic solvent, performing primary surface-modification on the hexagonal boron nitride, adding an amine-based silane compound to the first mixture, and then performing secondary surface-modification on the hexagonal boron nitride, preparing a second mixture by obtaining the secondarily surface-modified hexagonal boron nitride, and mixing the secondarily surface-modified hexagonal boron nitride, an imidazole-based curing agent, and an organic solvent, dispersing the second mixture, adding an epoxy resin to the second mixture, and then performing dispersion, and drying the organic solvent in the second mixture, and manufacturing a film using a product obtained by the drying.