Abstract: The leadframe of the present invention comprises a supporting bar having the first terminals and the second terminals, wherein the first terminals are coupled to the separating portion of the leadframe and the second terminals are used to support the chip. A plurality of inner leads connected to the supporting bar. A plurality of external leads connected to the inner leads; Adhesive material, formed on the leadframe and used to attach the chip to the inner leads, wherein the area of adhesive material is smaller than that of said chip. A plurality of bonding wires is used to couple the chip to the leadframe. Finally, the chip is encapsulated with the molding compound to protect the chip and the bonding wires.