Abstract: A low noise amplifier includes: an amplification unit including a first transistor and a second transistor connected in a cascode structure and configured to amplify a signal input to a control terminal of the first transistor; and a gain controller connected between a contact point at which the first transistor and the second transistor are connected to each other and a power source voltage, and configured to adjust a gain of the amplification unit.

Abstract: A camera module includes a housing, a lens holder configured to move in the housing in an optical axis direction, and a lens barrel coupled to the lens holder, wherein the lens holder includes a first support structure extending from one side surface in the optical axis direction and a second support structure located on a side surface opposite to the first support structure and extending in the optical axis direction, and the first support structure includes an extension protruding beyond the second support structure in the optical axis direction.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein a first carbon material is disposed in the internal electrode. The first carbon material includes carbon black, which has conductivity, a substantially spherical shape, and a particle diameter of 0.05 ?m or less.

Abstract: A camera module includes a housing, a first lens module configured to be movable in a first direction of the housing, a second lens module configured to be movable in the first direction, a first magnet disposed on the first lens module, a first yoke member disposed on the housing so as to face a first side surface of the first magnet and configured to limit a movement position of the first lens module with respect to the housing, and a second yoke member disposed on the second lens module so as to face a second side surface of the first magnet and configured to limit a movement position of the second lens module with respect to the first lens module.

Abstract: A camera module having a first housing including an image sensor converting an optical signal into an electrical signal, and a second housing including an imaging optical system focusing the optical signal on the image sensor and a first optical path conversion member disposed on an object-side surface of the imaging optical system and converting an optical path, and carried into or carried out of the first housing in a state of being coupled to the first housing.

Abstract: A charge pump circuit is provided. The charge pump circuit includes a first switch configured to have a first end connected to an input terminal that receives a power voltage; a second switch configured to have a first end connected to the input terminal; a first capacitor configured to have a first end connected to a second end of the first switch; a second capacitor connected between a second end of the first capacitor and a second end of the second switch; a third switch connected between the second end of the second switch and ground; a fourth switch connected between the first end of the first capacitor and a first output terminal and configured to output a first output voltage; and a fifth switch connected between a second output terminal and a node between the first capacitor and the second capacitor, and configured to output a second output voltage.

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer includes a first region extending from an interfacial surface with the internal electrode to 50 nm of the dielectric layer in an inward direction and a second region excluding the first region, and wherein, in the first region, an average content of In based on overall elements excluding oxygen is 0.5 at % or more and 2.0 at % or less, and an average content of Sn based on overall elements excluding oxygen is 0.5 at % or more and 1.75 at % or less.

Abstract: A camera module includes a plurality of lens modules having mutually different optical axes, a plurality of reflective members configured to change a path of light passing through at least one of the plurality of lens modules, and a housing having an internal space in which at least one of the plurality of lens modules is disposed. The plurality of lens modules include a first lens module including at least one lens disposed along a first optical axis, a second lens module including at least one lens disposed along a second optical axis, and a third lens module including at least one lens disposed along a third optical axis. The plurality of reflective members include a first reflective member opposing both the first lens module and the second lens module, and a second reflective member opposing both the second lens module and the third lens module.

Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)?0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15<v1-v3<45 is satisfied, where v1 is an Abbe number of the first lens, and v3 is an Abbe number of the third lens.

Abstract: An optical imaging system includes a first lens having an object-side surface that is convex; a second lens having a refractive power and a refractive index of 1.65 or more; a third lens having a refractive power; a fourth lens having a refractive power and an object-side surface that is convex; a fifth lens having a refractive power; a sixth lens having a positive refractive power; and a seventh lens having an object-side surface that is convex, wherein the first lens through the seventh lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and two or more of the first lens and the third lens through the seventh lens have a refractive index of 1.6 or more.

Abstract: An optical imaging system includes a first lens having a positive refractive power and a concave object-side surface, a second lens having a positive refractive power, a third lens having a negative refractive power, a fourth lens having a positive refractive power, and a fifth lens having a positive refractive power and a concave image-side surface. The first through fifth lenses are sequentially disposed in ascending numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system.

Abstract: A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO2, SiN, and SiCN.

Abstract: An optical system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens. The first lens includes an object-side surface that is convex with a meniscus shape. The second lens includes an image-side surface that is convex. The third lens includes an image-side surface that is concave. The fifth lens includes an image-side surface that is concave. The first to sixth lenses are sequentially disposed from an object side to an image side.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a reflective member, and an image sensor sequentially arranged from an object side. The reflective member includes at least two reflective surfaces to change a path of light passing through the first to third lenses and incident on the reflective member at least twice.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.

Abstract: There is provided an optical system including: a first lens having positive refractive power and having a convex object-side surface; a second lens having positive refractive power; a third lens having refractive power; a fourth lens having refractive power; a fifth lens having refractive power; a sixth lens having refractive power; and a seventh lens having negative refractive power and having a concave image-side surface, wherein the first to seventh lenses are sequentially disposed from an object side, whereby an aberration improvement effect may be increased and a high degree of resolution may be realized.

Abstract: A lens module assembly optimization method includes: in preparing a lens module including assembled N lenses respectively formed in cavities: receiving characteristic information of at least N lenses respectively formed in N cavity groups each including a respective plurality of cavities; and processing information for selecting N cavities from the N cavity groups, based on the characteristic information. A past cavity selection result, a fitness function configured based on data of the assembled N lenses or data of the prepared lens module according to the past cavity selection result, and a genetic algorithm are received or stored.

Abstract: A printed circuit board includes: a first interconnection layer; a first insulating layer covering at least a portion of a side surface of the first interconnection layer; a second insulating layer covering at least a portion of an upper surface of the first interconnection layer and at least a portion of an upper surface of the first insulating layer; a third insulating layer covering at least a portion of a lower surface of the first interconnection layer and at least a portion of a lower surface of the first insulating layer; a second interconnection layer disposed on an upper surface of the second insulating layer; and a third interconnection layer disposed on a lower surface of the third insulating layer.