Patents Assigned to Samsung Electro-Mechanics Co.
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Publication number: 20240155764Abstract: A printed circuit board includes: a first interconnection layer; a first insulating layer covering at least a portion of a side surface of the first interconnection layer; a second insulating layer covering at least a portion of an upper surface of the first interconnection layer and at least a portion of an upper surface of the first insulating layer; a third insulating layer covering at least a portion of a lower surface of the first interconnection layer and at least a portion of a lower surface of the first insulating layer; a second interconnection layer disposed on an upper surface of the second insulating layer; and a third interconnection layer disposed on a lower surface of the third insulating layer.Type: ApplicationFiled: February 1, 2023Publication date: May 9, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Ho CHOI, Seong Il JEON
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Publication number: 20240155225Abstract: A lens module assembly optimization method includes: in preparing a lens module including assembled N lenses respectively formed in cavities: receiving characteristic information of at least N lenses respectively formed in N cavity groups each including a respective plurality of cavities; and processing information for selecting N cavities from the N cavity groups, based on the characteristic information. A past cavity selection result, a fitness function configured based on data of the assembled N lenses or data of the prepared lens module according to the past cavity selection result, and a genetic algorithm are received or stored.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., KYONGGI UNIVERSITY INDUSTRY & ACADEMIA COOPERATION FOUNDATIONInventors: Hye Geun MIN, Ye Rim CHOI, Yeon Bin SON, Sung Hoon KIM, Eun Young CHOI
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Publication number: 20240155216Abstract: A camera module includes a plurality of lens modules having mutually different optical axes, a plurality of reflective members configured to change a path of light passing through at least one of the plurality of lens modules, and a housing having an internal space in which at least one of the plurality of lens modules is disposed. The plurality of lens modules include a first lens module including at least one lens disposed along a first optical axis, a second lens module including at least one lens disposed along a second optical axis, and a third lens module including at least one lens disposed along a third optical axis. The plurality of reflective members include a first reflective member opposing both the first lens module and the second lens module, and a second reflective member opposing both the second lens module and the third lens module.Type: ApplicationFiled: May 12, 2023Publication date: May 9, 2024Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hae Seung HYUN, Hyun KIM
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Patent number: 11977240Abstract: An apparatus configured to reduce an offset of a Hall sensor includes a voltage-current conversion circuit and a current mirror circuit. The voltage-current conversion circuit is configured to generate a current configured to decrease when a voltage of an input terminal to which a bias current of a Hall sensor is input increases and increase when the voltage of the input terminal decreases. The current mirror circuit has a current mirror structure configured to feedback the bias current based on the current generated by the voltage-current conversion circuit.Type: GrantFiled: February 3, 2021Date of Patent: May 7, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hwan Kim, Koon Shik Cho, Youn Joong Lee
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Patent number: 11978595Abstract: A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.Type: GrantFiled: April 4, 2022Date of Patent: May 7, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Jong Lee, Su Bong Jang, Min Cheol Park, Tae Ho Yun, Han Kim
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Patent number: 11978594Abstract: A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.Type: GrantFiled: April 17, 2023Date of Patent: May 7, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In Kyung Jung, Dong Hwi Shin
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Publication number: 20240141118Abstract: A surface-treated inorganic nanoparticle includes a core including Mania (TiO2); a shell surrounding the core, and including zirconia(ZrO2); and a dispersant including a phosphate functional group, and connected to the shell,Type: ApplicationFiled: February 7, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Chang Hyun YOON, Jung Hyun LEE, Eun Jung LIM, Young O KIM
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Publication number: 20240142597Abstract: Disclosed is a method of detecting a moving target by a target detecting apparatus. The method includes: acquiring radar data from a radar installed in a vehicle, extracting location coordinates of a moving target from the radar data, obtaining a line of a reflective surface on which a signal of the radar is reflected using location coordinates of a fixed object, determining whether the moving target is in a Line of Sight (LOS) area of the radar or in a Non Line of Sight (NLOS) area of the radar based on the location coordinates of the moving target and the line segment of the reflective surface, and based on determining that the moving target is in an area corresponding to the NLOS area of the radar, converting the location coordinates of the moving target into actual coordinates corresponding to an actual location of the moving target.Type: ApplicationFiled: January 30, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Wook SO, Gilha LEE, Taegyu RYU, YunJong LEE
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Publication number: 20240145171Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
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Publication number: 20240142856Abstract: A lens driving apparatus includes a first frame accommodating a lens barrel, a first optical image stabilization (OIS) driver including a first frictional contact portion disposed on the first frame, a first piezoelectric element configured to vibrate in a first direction, and a first rod connected to a first end of the first piezoelectric element, in contact with the first frictional contact portion, and configured to move the first frame in the first direction, and a second OIS driver that including a second frictional contact portion disposed on the first frame, a second piezoelectric element configured to vibrate in a second direction different from the first direction, and a second rod connected to a first end of the second piezoelectric element, in contact with the second frictional contact portion, and configured to move the first frame in the second direction.Type: ApplicationFiled: October 11, 2023Publication date: May 2, 2024Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Ho KIM, Donghoon LEE, Dooseub SHIN, Sanghyun JI, Dohwan KIM
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Publication number: 20240147634Abstract: The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.Type: ApplicationFiled: April 14, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: In Gun KIM
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Publication number: 20240142744Abstract: A lens module is provided. The lens module includes a first lens, a second lens, and a third lens sequentially disposed from an object side to an imaging side, a first spacing member disposed between the first lens and the second lens and having a first passage extending in a direction that intersects an optical axis, a second spacing member disposed between the second lens and the third lens and having a second passage extending in a direction that intersects the optical axis, and a lens barrel configured to accommodate the first lens, the second lens, the third lens, the first spacing member and the second spacing member, and configured to have a first connection passage disposed on an inner side surface and connected to the first passage and the second passage.Type: ApplicationFiled: September 6, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun Chong LEE, Hwan Soo PARK, Kyu Min CHAE, Hyuk Joo KIM
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Publication number: 20240145173Abstract: A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.Type: ApplicationFiled: June 2, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyeon LEE, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Yong PARK, Min Woo KIM, Jung Tae PARK, Sun Mi KIM, Sim Chung KANG
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Publication number: 20240145162Abstract: A coil component includes: a body having a first and a second surface opposing each other, and a third and a fourth surface opposing each other and connecting the first surface and second surface; a support member disposed within the body; first and second coils disposed on the support member; first and third external electrodes disposed on the body and connected to the first coil; second and fourth external electrodes disposed on the body and connected to the second coil; a first via electrode disposed within the body and connecting the first coil and the first external electrode; and a second via electrode disposed within the body and connecting the second coil and the second external electrode, wherein the first to fourth external electrodes are disposed on the first surface, the third external electrode extends onto the third surface, and the fourth external electrode extends onto the fourth surface.Type: ApplicationFiled: September 14, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Jin KIM, Boum Seock KIM, Jung Su HWANGBO, Han LEE, Jung Min PARK
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Publication number: 20240147620Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.Type: ApplicationFiled: April 17, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk LEE, Youn Gyu HAN, Jin Oh PARK, Yong Wan JI, Yong Duk LEE, Eun Sun KIM
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Publication number: 20240145167Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim
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Publication number: 20240145160Abstract: A coil component includes a body including a first surface and a second surface opposing each other and first to fourth side surfaces connecting the first and second surfaces; a first coil disposed within the body and including a first lead-out portion and a second lead-out portion extending to at least one of the first to fourth side surfaces of the body; a second coil disposed within the body and including a third lead-out portion and a fourth lead-out portion extending to at least one of the first to fourth side surfaces of the body; first to fourth external electrodes disposed on two adjacent side surfaces of the first to fourth side surfaces of the body and respectively connected to the first to fourth lead-out portions.Type: ApplicationFiled: September 28, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun Kim, Dong Hwan Lee, Dong Jin Lee, Boum Seock Kim
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Publication number: 20240145174Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.Type: ApplicationFiled: January 11, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Ghyu AHN, Soo Hwan SON, Young Key KIM
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Publication number: 20240147622Abstract: A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.Type: ApplicationFiled: March 7, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yoon LEE, Seung Eun LEE
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Publication number: 20240142754Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens having a negative refractive power, a fifth lens having a negative refractive power, a sixth lens, and a seventh lens having a positive refractive power. The first lens to seventh lens are sequentially disposed in a direction from an object side toward an imaging plane.Type: ApplicationFiled: January 3, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Hwa JUNG, Yong Joo JO