Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.

Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.

Abstract: A chip antenna includes: a body portion; a radiating portion disposed on one surface of the body portion in a width direction; and a ground portion disposed on another surface of the body portion in a width direction, wherein the radiating portion includes a dielectric substance and a conductor, and the dielectric substance and the conductor are respectively disposed in different regions in a thickness direction.

Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer.

Abstract: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.

Abstract: There is provided a hydrodynamic bearing assembly including: a shaft; a sleeve disposed to be spaced apart from the shaft by a predetermined interval to form a bearing clearance therewith; and a thrust member installed on the shaft, wherein at least one of the shaft, the sleeve, and the thrust member is provided with a dynamic pressure groove for generating fluid dynamic pressure in a lubricating fluid provided in the bearing clearance, and one side of a portion of the dynamic pressure groove into which the lubricating fluid is introduced is provided with a pressure reduction preventing groove for suppressing a reduction in pressure generated at the time of introduction of the lubricating fluid.

Abstract: Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon.

Abstract: Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. According to the present invention, cooling efficiency of the capacitor is maximized and fixing force of the capacitor in the cooling case is superior so that product reliability of the capacitor module can be improved.

Abstract: There is provided a semiconductor device having a High Electron Mobility Transistor (HEMT) structure allowing for enhanced performance and a method of manufacturing the same. The semiconductor device includes a base substrate; a semiconductor layer provided on the base substrate; a source electrode, a gate electrode and a drain electrode provided on the semiconductor layer to be spaced apart from one another; and an ohmic-contact layer partially provided at an interface between the drain electrode and the semiconductor layer.

Abstract: There is provided a wide-band direct conversion transmitting apparatus including: a local oscillation unit generating first, second, and third oscillation signal pairs each including a pair of signals having a phase difference of 90°; an image rejection mixer unit mixing baseband transmission signals including an I signal and a Q signal having a phase difference of 90° with the first oscillation signal pair; a harmonic rejection mixer unit mixing each of the first, second, and third oscillation signal pairs with the baseband transmission signals; and an output signal selecting unit selecting output signals from the image rejection mixer unit or from the harmonic rejection mixer unit.

Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

Abstract: Disclosed is a switch circuit capable of reducing distortion caused by harmonics and preventing an increase in insertion loss even if the number of ports increases. The switching circuit includes one common output port, M first switches having one set of ends connected in common to a first node (M?2 where M is a constant), N second switches having one set of ends connected in common to the common output port (N?1 where N is a constant), a third switch having one end connected to the common output port and the other end connected to the first node, M first input ports respectively connected to the other set of ends of the first switches, and N second input ports respectively connected to the other set of ends of the second switches. One selected among the first input ports and the second input ports is connected to the common output port, and if one of the first input ports is selected, the third switch is closed.

Abstract: A driving method of external electrode fluorescent lamp inverter for backlight. In the driving method, a square wave voltage frequency for driving the external electrode fluorescent lamp is applied to the primary side of a transformer in the region whose frequency is substantially ½ of the resonant frequency which is determined by the capacitance of the external electrode fluorescent lamp and the leakage inductance of the transformer. Then, the external electrode fluorescent lamp is caused to emit light by the self-discharge to thereby obtain high efficiency and high luminance.

Abstract: There is provided a sleep current adjusting circuit of a system on chip including: a regulator supplying a turn-on voltage and a normal current when a mode selection signal is a normal mode signal, and a turn-off voltage when the mode selection signal is a sleep mode signal; a switching device turned on by the turn-on voltage of the regulator to supply the normal current from the regulator to a main circuit part and a sleep operation circuit part, respectively, and turned off by the turn-off voltage of the regulator to block the normal current from being supplied to the main circuit part and supply the sleep current to the sleep operation circuit part; and a current limit device limiting an operating current flowing in response to the operating voltage and supplying the sleep current to the sleep operation circuit part.

Abstract: A flip chip-type nitride semiconductor light emitting diode includes a light transmittance substrate, an n-type nitride semiconductor layer, an active layer, a p-type nitride semiconductor layer and a mesh-type DBR reflecting layer. The mesh-type DBR reflecting layer has a plurality of open regions. The mesh-type DBR reflecting layer is composed of first and second nitride layers having different Al content. The first and second nitride layers are alternately stacked several times to form the mesh-type DBR reflecting layer. An ohmic contact layer is formed on the mesh-type DBR reflecting layer and on the p-type nitride semiconductor layer.

Abstract: Disclosed is a method for packaging a pickup device, which is used for a digital optical instrument, and particularly a method for fabricating an image sensor module connected to a flexible PCB. The method according to the invention includes the steps of forming a printed circuit of a predetermined pattern on an upper surface of a transparent medium, forming a first bump and a second bump on the upper surface of the transparent medium, first bonding the first bump with a pattern of an image chip so as to be electrically connected to each other, secondly bonding the second bump with a circuit of a flexible PCB so as to be electrically connected to each other, and molding a rear surface of the flexible PCB, on which an image chip is mounted, by means of epoxy resin. The method according to the invention provides an effect of reducing weight, thickness, length and size of the module in comparison with the module fabricated under the conventional wire bonding method.

Abstract: Disclosed is an electron beam deflection system capable of easily correcting an XH aberration and accurately correcting bi-directional YV aberration with a simple structure and a color tube using the electron beam deflection system. The electron beam deflection system according to the invention is positioned outside of a main body of a color tube having a neck, inside of which electron beams are arranged in a horizontal direction, and a display unit extended from the neck in its diameter for displaying images by means of electron beams scanned from the electron beams.

Abstract: A method for fabricating a microactuator for an inkjet head, which achieves easy formation of oxide piezoelectric elements and upper electrodes having desired patterns, using a patterning process mainly used in the fabrication of semiconductor devices. The method includes the steps of sequentially laminating a vibrating plate, a lower electrode, an oxide piezoelectric sheet, and an electrode layer, patterning the electrode layer, thereby forming upper electrodes of a desired pattern, and patterning the oxide piezoelectric sheet in accordance with an etching process while using the upper electrodes as a mask, thereby forming oxide piezoelectric elements of a desired pattern.