Patents Assigned to Samsung Electro-Mechanics
  • Apparatus and method for manufacturing metal nanoparticles
    Patent number: 7935169
    Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: May 3, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Il Lee, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
  • Multi-segment primary and multi-turn secondary transformer for power amplifier systems
    Patent number: 7936215
    Abstract: Embodiments of the invention may provide for power amplifier systems and methods. The systems and methods may include a power amplifier that generates a first differential output signal and a second differential output signal, a primary winding comprised of a plurality of primary segments, where a first end of each primary segment is connected to a first common input port and a second end of each primary segment is connected to a second common input port, where the first common input port is operative to receive the first differential output signal, and where the second common input port is operative to receive the second differential output signal, and a single secondary winding inductively coupled to the plurality of primary segments.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: May 3, 2011
    Assignees: Samsung-Electro Mechanics, Georgia Tech Research Corporation
    Inventors: Chang-Ho Lee, Ockgoo Lee, Jeonghu Han, Kyu Hwan An, Hyungwook Kim, Dong Ho Lee, Ki Seok Yang, Haksun Kim, Joy Laskar
  • Electrolyte solution for hydrogen generating apparatus and hydrogen generating apparatus comprising the same
    Patent number: 7935267
    Abstract: The invention provides an electrolyte solution for hydrogen generating apparatus including water; at least one ionizing compound; and at least one cation exchange resin, as well as a hydrogen generating apparatus that includes the electrolyte solution. The electrolyte solution for hydrogen generating apparatus according to the invention can increase the time and amount of hydrogen generation by reducing an amount of metal hydroxide generation.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: May 3, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Bosung Ku, Jae-Hyuk Jang, Kyoung-Soo Chae, Chang-Ryul Jung
  • Ball grid array substrate, semiconductor chip package and method of manufacturing the same
    Publication number: 20110095425
    Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.
    Type: Application
    Filed: August 30, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Hyun Park, Nam Keun Oh, Sang Duck Kim, Jong Gyu Choi, Young Ji Kim, Ji Eun Kim, Myung Sam Kang
  • Camera module package
    Publication number: 20110096224
    Abstract: There is provided a camera module package including: a lens barrel having a lens deposited therein; a housing having the lens barrel installed therein; a board bonded to the housing and having an image sensor provided on one surface thereof to coincide with an optical axis of the lens; and a shield can covering the outside of the housing and having a ground portion. The ground portion is protruded outwards from an outer side surface of the shield can and contacts an inner side surface of a socket when the shield can is inserted into the socket.
    Type: Application
    Filed: July 2, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Yeun Lee
  • Multilayer rigid flexible printed circuit board and method for manufacturing the same
    Publication number: 20110094776
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin
  • Camera module
    Publication number: 20110097063
    Abstract: There is provided a camera module. The camera module includes a housing accommodating a lens barrel in which a lens is arranged, a close range lens provided in the housing and covering the lens at the time of shooting at close range, and a driving unit driving the close range lens to cover the lens.
    Type: Application
    Filed: May 13, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Tae Jun Seo
  • Moving picture camera and electronic device including the same
    Publication number: 20110096456
    Abstract: There is provided a moving picture camera. The moving picture camera includes a case having an internal space, a frame supporting a camera module in the internal space, a printed circuit board on which circuit devices are mounted, the circuit devices receiving and processing a moving picture signal captured by the camera module, and an electrostatic transfer gasket interposed between the frame and the printed circuit board and transferring static electricity from the frame to the printed circuit board.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 28, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sung Hyun Kim
  • Flip chip package and method of manufacturing the same
    Publication number: 20110095421
    Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.
    Type: Application
    Filed: October 27, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ey Yong Kim, Young Hwan Shin, Soon Jin Cho, Jong Yong Kim, Jin Seok Lee
  • Motor
    Patent number: 7932654
    Abstract: A motor is disclosed. In accordance with an embodiment of the present invention, the motor includes a stator and a rotor, which is supported by the stator such that the rotor rotates. Here, the rotor includes a rotational axis, which is supported by the stator such that the rotational axis rotates, a rotating body, which rotates together with the rotational axis, and a hub, which has a ring-shaped body and a protruding part. Here, the ring-shaped body is interposed between the rotational axis and the rotating body, and the protruding part extends an outer circumferential surface of the ring-shaped body coupled to the rotating body. Thus, the motor can improve the coupling strength between the rotational axis and the rotating body, securing the rotating rotor's stability.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: April 26, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Viatcheslav Smirnov, Yeol Choi, Young-Sun Yoo
  • Super wide angle optical system
    Patent number: 7933078
    Abstract: There is provided a super wide angle optical system including, arranged about an optical axis: a first lens having a negative refractive power and having a meniscus shape with a convex object-side surface; a second lens having a negative refractive power and having a meniscus shape with a convex object-side surface; a third lens having a positive refractive power and having both convex surfaces; a fourth lens having a positive refractive power; a fifth lens having a negative refractive power; and a sixth lens having a positive refractive power and having both convex surfaces.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: April 26, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Phil Ho Jung, Moon Do Yi
  • Method for manufacturing metal nanoparticles
    Patent number: 7931730
    Abstract: The present invention provides a method for manufacturing metal nanoparticles, comprising: dissociating at least one metal precursor selected from the group consisting of silver, gold and palladium; reducing the dissociated metal precursor; and isolating the capped metal nanoparticles with an alkyl amine. The present invention provides a method for manufacturing metal nanoparticles which can be performed with simpler equipment compared to the gas phase method, can provide metal nanoparticles in high yield by only using alkyl amine without using any surfactant in high concentration which further allows mass production, and can provide metal nanoparticles having high dispersion stability and uniform size of 1-40 nm.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: April 26, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Jaewoo Joung
  • NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110091640
    Abstract: A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.
    Type: Application
    Filed: December 20, 2010
    Publication date: April 21, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Waun KIM, Seung Gyo Jeong
  • Haptic feedback device and electronic device
    Publication number: 20110090153
    Abstract: A haptic feedback device includes: a haptic device receiving a contact pressure applied thereto; a vibration plate attached with the haptic device by means of an anaerobic adhesive and transferring vibration; and an actuator provided to the haptic device such that the vibration plate is interposed between the haptic device and the actuator, and excited according to a change in the contact pressure of the haptic device to generate vibration.
    Type: Application
    Filed: December 22, 2009
    Publication date: April 21, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Sun Park, Yeon Ho Son, Kum Kyung Lee, Dae Woong Yun, Jae Kyung Kim
  • NOZZLE PLATE OF INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE NOZZLE PLATE
    Publication number: 20110091645
    Abstract: A nozzle plate of an inkjet printhead, and a method of manufacturing the nozzle plate. The nozzle plate includes a substrate through which nozzles are formed; an ink-philic coating layer formed on an outer surface of the substrate and inner walls of the nozzles; and an ink-phobic coating layer selectively formed on the ink-philic coating layer disposed around the nozzles.
    Type: Application
    Filed: December 28, 2010
    Publication date: April 21, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-woon CHA, Seung-mo Lim, Sung-gyu Kang, Jae-woo Chung
  • Electronic paper display device and manufacturing method of the same
    Publication number: 20110090555
    Abstract: The present invention provides an electronic paper display device including: a first electrode; a second electrode facing the first electrode; a barrier layer interposed between the first and second electrodes to define a plurality of cells; and a microcapsule disposed in each cell between the first and second electrodes and maintaining a ratio of minor axis to major axis of 0.9 to 1, and a manufacturing method of the same.
    Type: Application
    Filed: December 29, 2009
    Publication date: April 21, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwan Soo Lee, Yong Soo Oh, Sang Moon Lee, Hye Yeon Cha, Jeong Bok Kwak
  • Method of forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead
    Patent number: 7926177
    Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
    Type: Grant
    Filed: June 20, 2006
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-gyu Kang, Kae-dong Back, Seung-mo Lim, Jae-woo Chung
  • Nozzle plate for inkjet head and method of manufacturing the nozzle plate
    Patent number: 7926910
    Abstract: A nozzle plate for an inkjet head and a method of manufacturing the nozzle plate includes a silicon substrate having a nozzle, a thermally oxidized silicon layer formed on an outer surface of the silicon substrate and an inner wall of the nozzle, an adhesion layer deposited on the thermally oxidized silicon layer formed on the outer surface of the silicon substrate and formed of silicon oxide, and an ink-repellent coating layer deposited on the adhesion layer.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-woon Cha, Young-nam Kwon, Jae-chang Lee
  • Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
    Patent number: 7927517
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee Bae, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Tactile sensor
    Patent number: 7926364
    Abstract: A tactile sensor includes: a circuit board; a plurality of unit electrode pads; and a pressure sensing film, in which the circuit board can include: a first circuit pattern, implemented by electrically connecting unit electrode pads disposed in a same column among the plurality of unit electrode pads arranged in a 2-dimensional configuration; a second circuit pattern, implemented by electrically connecting unit electrode pads disposed in a same row among the plurality of unit electrode pads arranged in a 2-dimensional configuration; a third circuit pattern, implemented by electrically connecting unit electrode pads disposed in a same section among the plurality of unit electrode pads arranged in a 2-dimensional configuration, if assuming that the entire area in which the plurality of unit electrode pads are arranged is divided by sections.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Il-Kweon Joung