Abstract: The present invention provides a thermoelectric module. The thermoelectric module includes a first substrate and a second substrate opposed to each other and arranged to be separated from each other, a first electrode and a second electrode arranged in an inside surface of the first and the second substrates, respectively, a thermoelectric device inserted between the first and the second electrodes and electrically connected to the first and the second electrodes and a hybrid filler inserted between the first substrate and the second substrate and provided with a high temperature part filler adjacent to a substrate at a side of a high temperature end to absorb heat among the first substrate and the second substrate and a low temperature part filler adjacent to a substrate at a side of a low temperature end to discharge heat.
Type:
Application
Filed:
August 24, 2011
Publication date:
March 1, 2012
Applicant:
SAMSUNG ELECTRO-MICHANICS CO., LTD
Inventors:
Yong Suk Kim, Sung Ho Lee, Yong Soo Oh, Tae Kon Koo