Abstract: A micro light emitting diode (LED) device and a method of manufacturing the same are provided. A micro LED device includes a light emitting layer that is provided on a support substrate, a bonding layer, and a driver layer. The light emitting layer includes a stacked structure including a first semiconductor layer, an active layer, and a second semiconductor layer; first and second electrodes provided on a first side and a second side of the stacked structure; and a plurality of light emitting regions. The bonding layer is positioned between the support substrate and the light emitting layer. The drive layer includes a drive element electrically connected to the light emitting layer and is positioned on the light emitting layer to apply power to the plurality of light emitting regions of the light emitting layer.

Abstract: A multi-input folded camera includes a plurality of folding devices, a common lens array, and a sensor. The folding devices change paths lights that are incident to the folding devices and output a plurality of folded lights propagating along a plurality of paths. The common lens array combines the folded lights received through an input surface of the common lens array to output a combined light through an output surface of the common lens array. The sensor is at an optical axis of the common lens array to receive the combined light. Performance of a mobile device including the multi-input folded camera is enhanced by sufficient light amounts using the multiple folding devices and combining the lights through the multiple light paths. In implementing an under display camera (UDC), an entire-region display is supported without an aperture in a display panel.

Abstract: A high-band encoding/decoding method and device for bandwidth extension are provided. A high-band encoding method comprising the steps of: generating sub band-specific bit allocation information on the basis of a low-band envelope; determining, on the basis of the sub band-specific bit allocation information, the sub band requiring an envelope update in a high band; and generating, for the determined sub band, refinement data relating to the envelope update. A high-band decoding method comprising the steps of: generating sub band-specific bit allocation information on the basis of a low-band envelope; determining, on the basis of the sub band-specific bit allocation information, the sub band requiring an envelope update in a high band; and decoding, for the determined sub band, refinement data relating to the envelope update, thereby updating the envelope.

Abstract: A nonvolatile memory device includes a peripheral circuit including a first active region and a memory block including a second active region on the peripheral circuit. The memory block includes a vertical structure including pairs of a first insulating layer and a first conductive layer, a second insulating layer on the vertical structure, a second conductive layer and a third conductive layer spaced apart from each other on the second insulating layer, first vertical channels and second vertical channels. The second conductive layer and the third conductive layer are connected with a first through via penetrating the vertical structure, the second active region, and a region of the second insulating layer that is exposed between the second conductive layer and the third conductive layer.

Abstract: Provided are a dielectric including an oxide represented by Formula 1 below and having a cubic crystal structure, a capacitor including the dielectric, a semiconductor device including the dielectric, and a method of manufacturing the dielectric. (RbxA1-x)(ByTa1-y)O3-???<Formula 1> In Formula 1 above, A is K, Na, Li, Cs, or a combination thereof, B is Nb, V, or a combination thereof, and 0.1?x?0.2, 0?y?0.2, and 0???0.5 are satisfied.

Abstract: In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.

Abstract: A speech recognition method includes receiving speech data, obtaining candidate texts corresponding to the speech data and respective scores of the candidate texts using a speech recognition model, adjusting the score of a current candidate text, from among the obtained candidate texts, in response to a text length of the current candidate text satisfying a condition determined based on text lengths of the obtained candidate texts, and determining a target text corresponding to the speech data, from among the obtained candidate texts and the current candidate texts.

Abstract: A receiver including a plurality of primary antennas configured to receive a plurality of first carrier signals corresponding to at least a first frequency band of a plurality of frequency bands; a plurality of diversity antennas configured to receive a plurality of second carrier signals corresponding to at least a second frequency band of the plurality of frequency bands; a first local oscillator configured to generate a first oscillation signal; a first load circuit pair connected to the first local oscillator, and configured to frequency down-convert at least one first carrier signal of the plurality of first carrier signals, and having a first load circuit and a second load circuit adjacent to the first load circuit; and a second load circuit pair connected to the first local oscillator, configured to frequency down-convert at least one second carrier signal of the plurality of second carrier signals, and having a third load circuit and a fourth load circuit adjacent to the third load circuit.

Abstract: The present disclosure relates to a cooking apparatus including a heating device, a gas passage to guide gas supplied from the outside to the heating device, a gas valve configured to supply gas to the gas passage, a modulating valve configured to adjust the degree of opening of the gas passage, a boosting passage formed to be branched from a first portion of the gas passage and joined to a second portion of the gas passage positioned in the rear of the first portion along a direction in which gas in the gas passage flows, a boosting valve configured to open and close the boosting passage, a first nozzle disposed between the first portion and the second portion of the gas passage, and a second nozzle disposed between the second portion of the gas passage and the heating device.

Abstract: A method of updating a server knowledge graph, is performed by a server and includes obtaining a server knowledge graph of the server, and obtaining a plurality of device knowledge graphs by receiving a device knowledge graph from each of a plurality of devices. The method further includes generating a knowledge graph for server knowledge graph extension, based on the obtained plurality of device knowledge graphs, and updating the obtained server knowledge graph, using the generated knowledge graph for server knowledge graph extension.

Abstract: A semiconductor device is provided. The semiconductor device includes a clock gate line supplying a clock signal, an inverted clock gate line disposed in parallel to the clock gate line and supplying an inverted clock signal, a first latch circuit performing a first latch operation based on the clock signal and the inverted clock signal and a second latch circuit disposed on a side of the first latch circuit in a first direction, receiving an output of the first latch circuit, and operating based on the clock signal and the inverted clock, wherein the clock gate line and the inverted clock gate line extend in the first direction and are shared by the first and second latch circuits.

Abstract: An image processing method includes extracting a first region in a first image by inputting the first image to a pretrained neural network, upscaling a resolution of the first region by performing neural network-based super resolution processing on the first region, and upscaling a resolution of a second region in the first image from which the first region is excluded by performing interpolation on the second region.

Abstract: An apparatus for beam configuration in a wireless communication system, including a transceiver; and at least one processor connected with the transceiver and configured to: form at least one beam cluster from beams of a base station; determine a configuration of the at least one beam cluster; and configure the beams in the at least one beam cluster according to the determined configuration

Abstract: An electronic device includes a dielectric layer including crystal grains having aligned crystal orientations the dielectric layer may be between a substrate and a gate electrode. The dielectric layer may be between isolated first and second electrodes. A method of manufacturing an electronic device may include preparing a substrate having a channel layer, forming the dielectric layer on the channel layer, and forming a gate electrode on the dielectric layer.

Abstract: Embodiments herein provide a Static Random-Access Memory (SRAM) system with a delay tuning circuitry and a delay control circuitry and a method thereof. Delay tuning circuitry in the SRAM system may provide a tuning of reset time in the generation of an internal clock by introducing a delay. The delay is introduced according to a process state of periphery circuitry in the SRAM. A delay control circuitry provides a control over delay in reset time of the internal clock by varying a discharge rate for each of a Dummy Bit Line (DBL) circuitry and Complementary Bit Line Circuitry (CDBL), by connecting a stack of NMOS transistors over discharge NMOS transistors.

Abstract: A transmitter is provided. The transmitter includes: a Low Density Parity Check (LDPC) encoder configured to encode input bits to generate an LDPC codeword including the input bits and parity bits to be transmitted to a receiver in a current frame; a repeater configured to repeat, in the LDPC codeword, at least some bits of the LDPC codeword in the LDPC codeword so that the repeated bits are to be transmitted in the current frame; a puncturer configured to puncture some of the parity bits; and an additional parity generator configured to select at least some bits of the LDPC codeword including the repeated bits, and generate additional parity bits to be transmitted in a previous frame of the current frame.

Abstract: A dynamic power monitor for monitoring a power of a block in an integrated circuit is provided. The dynamic power monitor includes an input buffer configured to store first state values corresponding to internal signals of the block according to a first cycle of a clock signal; a power calculator configured to identify first power classification values corresponding to the block according to the first cycle, based on the first state values; and a filter configured to identify a first filtered value of the first power classification values.

Abstract: A neural network apparatus configured to perform a deconvolution operation includes a memory configured to store a first kernel; and a processor configured to: obtain, from the memory, the first kernel; calculate a second kernel by adjusting an arrangement of matrix elements comprised in the first kernel; generate sub-kernels by dividing the second kernel; perform a convolution operation between an input feature map and the sub-kernels using a convolution operator; and generate an output feature map, as a deconvolution of the input feature map, by merging results of the convolution operation.

Abstract: An antioxidant sensor includes a pressure sensor configured to obtain a contact pressure between an object and an optical sensor; the optical sensor configured to, based on the obtained contact pressure exceeding a set threshold pressure, emit a first light of a first wavelength to the object, and receive the first light reflected or scattered from the object; and a processor configured to determine a contact portion of the object in contact with the optical sensor, set a threshold pressure, among different threshold pressures, according to the determined contact portion, and determine an antioxidant value based on the received first light.

Abstract: The method of manufacturing an interposer includes providing a substrate including a first region and a second region adjacent to the first region, forming a first mold structure on the substrate, forming a photoresist layer on the first mold structure, forming a first transfer pattern over the photoresist layer on the first region, using a first photomask, forming a second transfer pattern over the photoresist layer on the second region, using the first photomask, forming a mask pattern on the first mold structure, using the first transfer pattern and the second transfer pattern and forming a first trench and a second trench in the first mold structure, using the mask pattern, the first trench being formed in the first region, and the second trench being formed in the second region.