Patents Assigned to Samsung Electronics America, Inc.
  • Method of heat dissipation from two surfaces of a microprocessor
    Patent number: 6000125
    Abstract: A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: December 14, 1999
    Assignee: Samsung Electronics America, Inc.
    Inventor: Ki B. Kang
  • Surface complemental heat dissipation device
    Patent number: 5790379
    Abstract: A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: August 4, 1998
    Assignee: Samsung Electronics America, Inc.
    Inventor: Ki B. Kang