Patents Assigned to Samsung Electronics Co., Ltd.
  • Patent number: 11660053
    Abstract: An apparatus and a method for monitoring a bio-signal measuring condition are disclosed. The apparatus includes a bio-signal receiver configured to receive a bio-signal that is measured from a user, and a processor configured to extract any one or any combination of a waveform feature, a period feature, and an amplitude feature, from the received bio-signal, determine whether the extracted any one or any combination of the waveform feature, the period feature, and the amplitude feature are normal, using at least one predetermined determination reference corresponding to the extracted any one or any combination of the waveform feature, the period feature, and the amplitude features, and monitor a measuring condition of the received bio-signal, based on whether the extracted any one or any combination of the waveform feature, the period feature, and the amplitude feature are determined to be normal.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Keun Yoon, Ui Kun Kwon, Dae Geun Jang
  • Patent number: 11663008
    Abstract: A memory device includes a memory having a memory bank, a processor in memory (PIM) circuit, and control logic. The PIM circuit includes instruction memory storing at least one instruction provided from a host. The PIM circuit is configured to process an operation using data provided by the host or data read from the memory bank and to store at least one instruction provided by the host. The control logic is configured to decode a command/address received from the host to generate a decoding result and to perform a control operation so that one of i) a memory operation on the memory bank is performed and ii) the PIM circuit performs a processing operation, based on the decoding result. A counting value of a program counter instructing a position of the instruction memory is controlled in response to the command/address instructing the processing operation be performed.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sukhan Lee, Shinhaeng Kang, Namsung Kim, Seongil O, Hak-Soo Yu
  • Patent number: 11660563
    Abstract: An apparatus for collecting a by-product, includes: a chamber provided with a gas inlet and a gas outlet and having an internal space; a heater disposed on the gas inlet side of the internal space within the chamber and varying a heating temperature in time series; a vortex forming member disposed around the heater; a plurality of first collecting members disposed below the heater; a second collecting member disposed below the first collecting member so that a plurality of second collecting members intersect each other; and a third collecting member disposed on the gas outlet side of the internal space within the chamber.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seoyoung Maeng, Iljun Jeon, Suji Gim, Youngseok Roh, Jongyong Bae, Jungjoon Pyeon
  • Patent number: 11662593
    Abstract: One or more embodiments of the present disclosure may include: a transparent member; a housing coupled to the transparent member in a rotatable manner via a hinge portion, such that the housing is foldable in a designated direction with respect to the transparent member; a projector at least partially disposed in the housing; and an optical transferring member configured to guide light emitted from the projector to the transparent member when the housing is unfolded with respect to the transparent member in an unfolded state.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: May 30, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yunguk Lee, Yoonseok Kang
  • Patent number: D987612
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: May 30, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Wook Yoo, Sin-Wi Moon, Dae-Hun Jung, Byung-Min Woo, Dong-Wook Kim, Jee-Won Kim
  • Patent number: D987613
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Myung, Dahyun Lee, Junho Jin, Bosoon Kang, Jinhoo Lee, Junwon Lee, Namsu Kim, Jiyun Lim, Kangmoon Kim
  • Patent number: D987614
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Myung, Dahyun Lee, Junho Jin, Bosoon Kang, Jinhoo Lee, Junwon Lee, Namsu Kim, Jiyun Lim, Kangmoon Kim
  • Patent number: D987615
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Myung, Dahyun Lee, Junho Jin, Bosoon Kang, Jinhoo Lee, Junwon Lee, Namsu Kim, Jiyun Lim, Kangmoon Kim
  • Patent number: D987616
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Myung, Dahyun Lee, Junho Jin, Bosoon Kang, Jinhoo Lee, Junwon Lee, Namsu Kim, Jiyun Lim, Kangmoon Kim
  • Patent number: D987639
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han-Hong Lee, Seon-Gyun Baek
  • Patent number: D987640
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yusuf Cinar, Han Hong Lee, Seon Gyun Baek
  • Patent number: D987658
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa
  • Patent number: D987659
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa
  • Patent number: D987660
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa
  • Patent number: D987661
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa, Dasom Kim
  • Patent number: D987662
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa
  • Patent number: D987672
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eunsil Lim, Yeonjoo Jwa
  • Patent number: D987676
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongwoo Shin, Saebyuk Sheen
  • Patent number: D987796
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cheol-Yeon Jo, Min-Kyung Choi, Sang-In Lee, Yea-Seul You
  • Patent number: RE49538
    Abstract: A method of fabricating a semiconductor device includes forming an interlayer dielectric on a substrate, the interlayer dielectric including first and second openings respectively disposed in first and second regions formed separately in the substrate; forming a first conductive layer filling the first and second openings; etching the first conductive layer such that a bottom surface of the first opening is exposed and a portion of the first conductive layer in the second opening remains; and forming a second conductive layer filling the first opening and a portion of the second opening.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: May 30, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoonjoo Na, Sangjin Hyun, Yugyun Shin, Hongbae Park, Sughun Hong, Hye-Lan Lee, Hyung-Seok Hong