Abstract: A plasma processing apparatus includes: a plasma chamber including a first area and a second area; a first radio frequency (RF) power source transmitting pieces of first RF power to the first area; a second RF power source transmitting second RF power to the second area; a controller configured to control the first RF power source and the second RF power source; and a first coil and a second coil arranged in the second area, wherein the controller spatially controls plasma in the first and second areas by controlling a signal of a current applied to the first coil and a signal of a current applied to the second coil, and temporally controls the plasma in the first and second areas by controlling a signal of the first RF power transmitted from the first RF power source and a signal of the second RF power transmitted from the second RF power source.

Abstract: A method for writing memory cells including: applying a program voltage to a target wordline; grounding bitlines of memory cells to be written to a first resistance state; setting a bitline voltage of unselected bitlines; and setting a wordline voltage of unselected wordlines; applying the program voltage to a target bitline; grounding wordlines of the memory cells to be written to a second resistance state; setting the wordline voltage of the unselected wordlines to a first value if a peak of a maximum voltage drop is greater than or equal to a second value; otherwise, setting the wordline voltage to zero; and setting the bitline voltage of the unselected bitlines to a third value if the peak of the maximum voltage drop is greater than or equal to the second value; otherwise, setting the bitline voltage to zero.