Patents Assigned to Samsung Elelctronics Co., Ltd.
  • Patent number: 10156769
    Abstract: A two-dimensional (2D) beam steering device may include a variable refractive index panel configured to generate a prism effect, a waveguide in contact with a surface of the variable refractive index panel, and an electro-optic prism disposed on a surface of the waveguide. The variable refractive index panel may include a variable refractive index layer, a common electrode layer, and an electrode pattern layer. The common electrode layer and the electrode pattern layer may face each other with the variable refractive index layer therebetween.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: December 18, 2018
    Assignee: SAMSUNG ELELCTRONICS CO., LTD.
    Inventors: Jungwoo Kim, Changgyun Shin, Sunil Kim
  • Publication number: 20130179828
    Abstract: A display apparatus and a control method thereof are provided. The display apparatus includes: an image processor which processes an image signal; a display unit which displays an image thereon based on the processed image signal; a user input unit which receives a user input; and a controller which displays a plurality of selectable items on the display unit, and upon receiving a first user input to select a first item from the plurality of selectable items from the user input unit, displays a display window displaying an input result of the first user input in a vicinity of the first item, and upon receiving a second user input to select a second item, which is different from the first item, from the user input unit, controls the display unit to move and display the display window in a vicinity of the second item.
    Type: Application
    Filed: January 7, 2013
    Publication date: July 11, 2013
    Applicant: Samsung Elelctronics Co., Ltd.
    Inventor: Samsung Electronics Co., Ltd.
  • Patent number: 7078800
    Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: July 18, 2006
    Assignee: Samsung Elelctronics Co., Ltd.
    Inventors: Heung-Kyu Kwon, Se-Yong Oh, Min-Ha Kim, Tae-Je Cho
  • Patent number: D771160
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: November 8, 2016
    Assignee: SAMSUNG ELELCTRONICS CO., LTD.
    Inventors: Seo-Jin Park, Young-Min Park, Jong-Hyub Lee