Abstract: Provided is a semiconductor memory device including cylinder type storage nodes and a method of fabricating the semiconductor memory device. The semiconductor memory device includes: a semiconductor substrate including switching devices; a recessed insulating layer including storage contact plugs therein, wherein the storage contact plugs are electrically connected to the switching devices and the recessed insulating layer exposes at least some portions of upper surfaces and side surfaces of the storage contact plugs. The semiconductor device further includes cylinder type storage nodes each having a lower electrode. The lower electrode contacting the at least some portions of the exposed upper surfaces and side surfaces of the storage node contact plugs.
Type:
Grant
Filed:
August 7, 2009
Date of Patent:
November 15, 2011
Assignee:
Samsunge Electronics Co., Ltd.
Inventors:
Gil-Sub Kim, Won-Mo Park, Seong-Ho Kim, Dong-Kwan Yang