Abstract: A substrate processing apparatus includes an ultraviolet (UV) exposure apparatus configured to irradiate a reticle with a UV beam and an extreme ultraviolet (EUV) exposure apparatus configured to irradiate the reticle, which has been irradiated with the UV beam by the UV exposure apparatus, with an EUV beam. The UV exposure apparatus includes a UV exposure chamber configured to house the reticle, a supporting portion configured to support the reticle in the UV exposure chamber, and a UV lamp on a bottom surface of the UV exposure chamber and facing the supporting portion in a first direction intersecting the bottom surface. The UV lamp is configured to irradiate the reticle with the UV beam to remove an oxide layer on the reticle.

Abstract: An integrated circuit is provided. The integrated circuit includes: a voltage-dividing circuit including a plurality of resistors connected to each other in series, wherein the voltage-dividing circuit is configured to generate, based on a test signal, an internal test signal, at least one first reference signal, and at least one second reference signal; a first low-pass filter configured to receive the at least one first reference signal and generate a first reference voltage; a second low-pass filter configured to receive the at least one second reference signal and generate a second reference voltage; a first comparator configured to compare the first reference voltage to the internal test signal; and a second comparator configured to compare the second reference voltage to the internal test signal.

Abstract: Provided is a splitter including an input portion, an output portion, and a waveguide connected between the input portion and the output portion, wherein widths of adjacent portions in at least some regions of the waveguide change discontinuously, and wherein a deviation between the widths of the adjacent portions is less than a wavelength of input light in a vacuum.

Abstract: A processor-implemented method includes generating marker information based on a design rule for a reference polygon, encoding the marker information into a feature vector, and generating a pattern image that includes the reference polygon by inputting the feature vector into an artificial intelligence (AI) model.

Abstract: A storage device may include a non-volatile memory device and a storage controller including a phase-locked loop circuit, the phase-locked loop circuit may include a phase detector configured to output a phase-difference signal corresponding to a phase difference between the reference clock signal and the feedback clock signal; a voltage generator configured to generate an input voltage corresponding to the phase-difference signal and output the input voltage; an oscillator configured to generate an output clock signal having a frequency corresponding to the input voltage and output the output clock signal; a reset synchronization circuit configured to synchronize the reset signal based on the reference clock signal, and output a synchronous reset signal, and a frequency divider configured to reset based on the synchronous reset signal, generate the feedback clock signal by dividing a frequency of the output clock signal, and output the feedback clock signal.

Abstract: Methods, devices, and systems for training a deep learning recommendation model (DLRM), including: offloading one or more storage tables to a memory device; training a DLRM based on training data, wherein during the training, a storage table prefetched from the memory device is loaded according to a training phase; and storing feature data obtained during the training into the loaded storage table.

Abstract: A display apparatus including first and second display modules arranged adjacently with a boundary line therebetween; and a controller configured to control first pixels of the first display module and second pixels of the second display module based on image data, wherein the first pixels include first boundary pixels adjacent to the boundary line, the second pixels include second boundary pixels adjacent to the boundary line, each first boundary pixel and each second boundary pixel includes a plurality of light-emitting elements including a first light-emitting element at a first location to output light of a first color, and a second light-emitting element at a second location further from the boundary line to output light of a second color, and the controller is configured to adjust luminances of the first and second light-emitting elements according to reference luminances of the first and second light-emitting element determined based on the image data.

Abstract: A semiconductor memory device includes a ternary content-addressable memory (TCAM) array including a plurality of TCAM cells each including two dynamic random-access memory (DRAM) cells and a logic circuit, and a peripheral circuit configured to control an operation of the TCAM array. Each of the two DRAM cells includes an access transistor and a storage capacitor, wherein the logic circuit is configured to operate in response to a power supply voltage and output, to an output node, a voltage corresponding to a result of an exclusive OR (XOR) operation between search data corresponding to a voltage applied to a select line and stored data stored in the storage capacitor. The output node of each of the plurality of TCAM cells may be connected to a match line through a respective output capacitor.

Abstract: Provided are an image sensor and an image processing device including the same. The image sensor includes a pixel array including a plurality of pixel groups, wherein at least one pixel group from among the plurality of pixel groups includes a first pixel configured to generate image data and a second pixel configured to generate event data, and the first pixel and the second pixel included in the same pixel group are configured to receive an optical signal of a same color, and a dynamic vision sensor (DVS) circuit configured to generate an event signal, based on an electrical signal corresponding to charge generated from the second pixel.

Abstract: A method of manufacturing a semiconductor package, comprising includes forming support structures having a predetermined height in a vertical direction from an upper surface of a package substrate, stacking a plurality of semiconductor chips in a stair-step configuration up to a height equal to the predetermined height of the support structures, stacking an uppermost semiconductor chip on the support structures and the semiconductor chips, and connecting a conductive wire on the uppermost semiconductor chip, forming the support structures includes extending a conductive material drawn from a capillary to have a predetermined length equal to the predetermined height from the package substrate to contact a contact pad, forming a scratched portion in the conductive material in a state in which the conductive material is not attached to another contact pad, and erecting the conductive material by moving the capillary in the vertical direction and cutting the scratched portion of the conductive material.

Abstract: A method of manufacturing an integrated circuit device, includes forming a de-bonding layer on a carrier substrate, the de-bonding layer including a metallic oxide, forming a light absorbing layer on the de-bonding layer, forming a bonding layer on the light absorbing layer, and bonding an integrated circuit substrate structure to the bonding layer, and irradiating the carrier substrate with light to separate the de-bonding layer from the light absorbing layer. The de-bonding layer has a thermal expansion coefficient that is 10 times or greater than 10 times a thermal expansion coefficient of the light absorbing layer.

Abstract: An image sensor includes an active pixel sensor region outputting a pixel signal for generating images, and a peripheral region surrounding the active pixel sensor region, wherein the active pixel sensor region and the peripheral region include a sensor substrate including multiple pixels extending in the active pixel sensor region and the peripheral region, an optical-transparent layer arranged over the sensor substrate, separated from the sensor substrate, and including at least one dielectric material, and a planarization layer between the sensor substrate and the optical-transparent layer.

Abstract: An air cleaner including a first housing including a first suction port and a first discharge port; a first fan inside the first housing; a coupling duct on an upper portion of the first housing; a second housing including a second suction port and a second discharge port; a second fan inside the second housing; and a coupling base on a lower portion of the second housing and including a guide surface sloping outwardly in an upward direction, wherein the coupling base is separably couplable to the coupling duct. When the coupling base and coupling duct are coupled, a portion of air discharged through the first discharge port is guided by the guide surface and discharged outside of the second housing, and when the coupling base and coupling duct are separated, air is guided by the guide surface into the second housing.

Abstract: A method performed by an electronic device according to an embodiment, includes determining a target point based on a radar signal, determining a first angle set for the target point by using a first array in a virtual MIMO array and determining a second angle set for the target point by using a second array in the virtual MIMO array, generating angle pairs respectively including a corrected first angle and a corrected second angle, determining a matching score for each of the angle pairs by using a third array corresponding to a portion of the virtual MIMO array, and generating multi-angle information of the target point based on target angle pairs, among the angle pairs, of which corresponding matching scores satisfy a predetermined criterion.

Abstract: A processor-implemented method includes acquiring a data set for a plurality of factors, which is associated with a semiconductor fabrication process, of a plurality of chips included in a wafer, generating a first sub-data set corresponding to a first area among a plurality of areas in the wafer by dividing the data set based on location data corresponding to each of the plurality of chips, the location data included in the data set, identifying, from among the plurality of factors, one or more factors satisfying a condition that is set for the first sub-data set, and learning a first estimation model corresponding the first area based on a second sub-data set for the one or more factors of a chip included in the first area.

Abstract: An electronic device including a first display configured to emit light toward a front surface of the first display, a second display, disposed in front of the front surface of the first display, configured to transmit light from a rear surface to a front surface, a distance adjusting unit configured to change a distance between the first display and the second display, at least one processor including processing circuitry, and memory including one or more storage mediums storing instructions. The instructions, when executed by the at least one processor individually or collectively, cause the electronic device to display a first screen through the first display, display a second screen through the second display, identify whether an event to change the distance, and adjust through the distance adjusting unit, based on the event, the distance between the first display and the second display.

Abstract: An electronic device includes a display, a polarization control array, a lens array, at least one processor, and memory. The electronic device generates, based on an input image and information about the two-dimensional display region and the three-dimensional display region of the input image, a polarization information map including at least one of a two-dimensional region corresponding to a two-dimensional display region or a three-dimensional region corresponding to a three-dimensional display region, and synchronizes the display and the polarization control array to simultaneously control the display to display an image based on the input image and control the polarization control array to control a liquid-crystal alignment of the polarization control array based on the polarization information map.

Abstract: A robot includes: a plurality of sensors; a driving assembly configured to move the robot; memory storing instructions; and a processor, wherein the instructions, when executed by the processor, cause the robot to: obtain a guide map for guiding map generation and store the guide map in the memory, convert the guide map into a map form recognizable by the robot, identify a search boundary determined based on the map form, and control the driving assembly to move the robot within the search boundary, generate a sensing map of a space, in which the robot moves, based on a sensing value sensed by the plurality of sensors, and match the guide map with the sensing map and generate a space map of the space.

Abstract: An auxiliary sensing and control system for semiconductor equipment, includes a sensor and automation module including an automation device and a sensor additionally installed in the semiconductor equipment, a sensor and automation device control module for controlling the sensor and automation module, and a data integration operation module for controlling trace data of the semiconductor equipment and data acquired by the automation device of the sensor and automation module to a host system, and receiving and processing a control signal of the host system.

Abstract: Method and apparatus for generating a real-time operation assistance screen for precision machining equipment is provided. Method may include receiving user input to designate a region of interest and select one or more execution target recipes; capturing, in real time, an image on the display displaying the operation UI of the precision machining equipment and associated with the region of interest; generating a real time assistance screen of the precision machining equipment based on the captured image of the region of interest and the execution target recipe; and displaying the generated real-time assistance screen on the display. In embodiments, the real-time assistance screen includes real-time assistance output based on an analysis of the input image and the execution target recipe, and the capturing, the generating, and the displaying the generated screen include no direct information exchange with a program associated with the operation UI of the precision machining equipment.