Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.
Type:
Grant
Filed:
July 9, 2021
Date of Patent:
December 12, 2023
Assignee:
SAMWON ACT CO., LTD.
Inventors:
Kyung Wook Lee, Kyung Yul Lee, Hong Seok Han
Abstract: The present invention provides a belt member comprising: a tubular body; and a belt member unit comprising #1 protrusion area located at #1 predetermined position of the body, where by inserting and placing each protrusion area of layer #2 belt member in each opening of layer #1 belt member, the layer #1 belt member and the layer #2 belt member can be prevented from falling out.
Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).
Abstract: The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.
Abstract: The present invention is configured as follows. The present invention relates to a system wall characterized by comprising: a bracket attached to a wall part; a support attached to the bracket; a hole-processed metal panel corresponding to the support; and a decorative part inserted into the support protruding from the hole-processed metal panel.
Abstract: The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.
Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
Type:
Grant
Filed:
January 9, 2017
Date of Patent:
March 29, 2022
Assignees:
SAMWON ACT CO., LTD., EMOT CO., LTD., KOREA INSTITUTE OF MATERIALS SCIENCE
Inventors:
Kyung Yul Lee, Kyung Wook Lee, Jun Sang Jeong, Yang Seok Lee, Man Kim, Joo Yul Lee, Sang Yeoul Lee
Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
Type:
Application
Filed:
January 9, 2017
Publication date:
January 24, 2019
Applicants:
Samwon Act Co., Ltd, Emot Co., Ltd., Korea Institute of Machinery & Materials
Inventors:
Kyung Yul LEE, Kyung Wook LEE, Jun Sang JEONG, Yang Seok LEE, Man KIM, Joo Yul LEE, Sang Yeoul LEE