Patents Assigned to Samwon Act Co., Ltd
  • Patent number: 11840844
    Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 12, 2023
    Assignee: SAMWON ACT CO., LTD.
    Inventors: Kyung Wook Lee, Kyung Yul Lee, Hong Seok Han
  • Patent number: 11821491
    Abstract: The present invention provides a belt member comprising: a tubular body; and a belt member unit comprising #1 protrusion area located at #1 predetermined position of the body, where by inserting and placing each protrusion area of layer #2 belt member in each opening of layer #1 belt member, the layer #1 belt member and the layer #2 belt member can be prevented from falling out.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: November 21, 2023
    Assignee: SAMWON ACT CO., LTD.
    Inventor: Kwang Ho Bae
  • Patent number: 11665828
    Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 30, 2023
    Assignee: SAMWON ACT CO., LTD.
    Inventors: Kyung Yul Lee, Kwang Jong Choi, Pyoung Woo Lee, Doo Yul Baek
  • Publication number: 20220356715
    Abstract: The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.
    Type: Application
    Filed: June 25, 2020
    Publication date: November 10, 2022
    Applicant: SAMWON ACT CO., LTD.
    Inventors: Kyung Wook LEE, Kyung Yul LEE, Hong Suk HAN, Jae Sung CHOI
  • Publication number: 20220243478
    Abstract: The present invention is configured as follows. The present invention relates to a system wall characterized by comprising: a bracket attached to a wall part; a support attached to the bracket; a hole-processed metal panel corresponding to the support; and a decorative part inserted into the support protruding from the hole-processed metal panel.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 4, 2022
    Applicant: SAMWON ACT CO., LTD.
    Inventors: Kyung Wook LEE, Kyung Yul LEE, Hong Suk HAN, Jae Sung CHOI
  • Publication number: 20220231495
    Abstract: The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.
    Type: Application
    Filed: June 25, 2020
    Publication date: July 21, 2022
    Applicant: SAMWON ACT CO., LTD.
    Inventors: Kyung Wook LEE, Kyung Yul LEE, Hong Suk HAN, Jae Sung CHOI
  • Patent number: 11291123
    Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: March 29, 2022
    Assignees: SAMWON ACT CO., LTD., EMOT CO., LTD., KOREA INSTITUTE OF MATERIALS SCIENCE
    Inventors: Kyung Yul Lee, Kyung Wook Lee, Jun Sang Jeong, Yang Seok Lee, Man Kim, Joo Yul Lee, Sang Yeoul Lee
  • Publication number: 20190029124
    Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
    Type: Application
    Filed: January 9, 2017
    Publication date: January 24, 2019
    Applicants: Samwon Act Co., Ltd, Emot Co., Ltd., Korea Institute of Machinery & Materials
    Inventors: Kyung Yul LEE, Kyung Wook LEE, Jun Sang JEONG, Yang Seok LEE, Man KIM, Joo Yul LEE, Sang Yeoul LEE