Patents Assigned to Samwon Act Co., Ltd
  • CIRCUIT BOARD
    Publication number: 20190029124
    Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
    Type: Application
    Filed: January 9, 2017
    Publication date: January 24, 2019
    Applicants: Samwon Act Co., Ltd, Emot Co., Ltd., Korea Institute of Machinery & Materials
    Inventors: Kyung Yul LEE, Kyung Wook LEE, Jun Sang JEONG, Yang Seok LEE, Man KIM, Joo Yul LEE, Sang Yeoul LEE