Abstract: A light-emitting diode (LED) projection device for a camera has a substrate and at least one LED package mounted on the substrate. Each LED package includes a reflection surface, at least one LED chip disposed in the reflection surface, and a packaging lens encapsulating the at least one LED chip. By choosing a suitable amount of the LED chips that have suitable sizes and displacements and are encapsulated by suitable types of the packaging lenses, the light beams emitted from the LED chips can form a substantially rectangular light pattern that corresponds in shape to a field of view of the lens assembly. The brightness of the light pattern having better uniformity is formed and the dark area around the light pattern is reduced. The desired light pattern can be formed through simple manufacturing process and structure.