Abstract: A method of selecting an injectate for recovering liquid hydrocarbons from a reservoir includes designing a plurality of injectates, calculating a net present value of each injectate, and selecting a candidate injectate based on the net present value. For example, the candidate injectate may be selected to maximize the net present value of a waterflooding operation.

Abstract: The present invention provides for novel compositions and methods for recycling or recovering ionic liquid used in IL pretreated cellulose and/or lignocellulosic biomass (LBM).

Abstract: The various technologies presented herein relate to detecting nuclear material at a large stand-off distance. An imaging system is presented which can detect nuclear material by utilizing time encoded imaging relating to maximum and minimum radiation particle counts rates. The imaging system is integrated with a data acquisition system that can utilize variations in photon pulse shape to discriminate between neutron and gamma-ray interactions. Modulation in the detected neutron count rates as a function of the angular orientation of the detector due to attenuation of neighboring detectors is utilized to reconstruct the neutron source distribution over 360 degrees around the imaging system. Neutrons (e.g.

Abstract: Detection and deterrence of spoofing of user authentication may be achieved by including a cryptographic fingerprint unit within a hardware device for authenticating a user of the hardware device. The cryptographic fingerprint unit includes an internal physically unclonable function (“PUF”) circuit disposed in or on the hardware device, which generates a PUF value. Combining logic is coupled to receive the PUF value, combines the PUF value with one or more other authentication factors to generate a multi-factor authentication value. A key generator is coupled to generate a private key and a public key based on the multi-factor authentication value while a decryptor is coupled to receive an authentication challenge posed to the hardware device and encrypted with the public key and coupled to output a response to the authentication challenge decrypted with the private key.

Abstract: An X-ray contrast sensitivity gauge is described herein. The contrast sensitivity gauge comprises a plurality of steps of varying thicknesses. Each step in the gauge includes a plurality of recesses of differing depths, wherein the depths are a function of the thickness of their respective step. An X-ray image of the gauge is analyzed to determine a contrast-to-noise ratio of a detector employed to generate the image.

Abstract: Novel photo-writable and thermally switchable polymeric materials exhibit a refractive index change of ?n?1.0 when exposed to UV light or heat. For example, lithography can be used to convert a non-conjugated precursor polymer to a conjugated polymer having a higher index-of-refraction. Further, two-photon lithography can be used to pattern high-spatial frequency structures.

Abstract: A method including forming a diamond material on the surface of a substrate; forming a first contact and a separate second contact; and patterning the diamond material to form a nanowire between the first contact and the second contact. An apparatus including a first contact and a separate second contact on a substrate; and a nanowire including a single crystalline or polycrystalline diamond material on the substrate and connected to each of the first contact and the second contact.

Abstract: The synthesis of a polyoxometalate-loaded epoxy uses a one-step cure by applying an external stimulus to release the acid from the polyoxometalate and thereby catalyze the cure reaction of the epoxy resin. Such polyoxometalate-loaded epoxy composites afford the cured epoxy unique properties imparted by the intrinsic properties of the polyoxometalate. For example, polyoxometalate-loaded epoxy composites can be used as corrosion resistant epoxy coatings, for encapsulation of electronics with improved dielectric properties, and for structural applications with improved mechanical properties.

Abstract: In an embodiment, a power selective optical filter device includes an input polarizer for selectively transmitting an input signal. The device includes a wave-plate structure positioned to receive the input signal, which includes at least one substantially zero-order, zero-wave plate. The zero-order, zero-wave plate is configured to alter a polarization state of the input signal passing in a manner that depends on the power of the input signal. The zero-order, zero-wave plate includes an entry and exit wave plate each having a fast axis, with the fast axes oriented substantially perpendicular to each other. Each entry wave plate is oriented relative to a transmission axis of the input polarizer at a respective angle. An output polarizer is positioned to receive a signal output from the wave-plate structure and selectively transmits the signal based on the polarization state.

Abstract: Doped luminescent materials are provided for converting excited triplet states to radiative hybrid states. The doped materials may be used to conduct pulse shape discrimination (PSD) using luminescence generated by harvested excited triplet states. The doped materials may also be used to detect particles using spectral shape discrimination (SSD).

Abstract: An ultra-wideband (UWB) radar transmitter apparatus comprises a pulse generator configured to produce from a sinusoidal input signal a pulsed output signal having a series of baseband pulses with a first pulse repetition frequency (PRF). The pulse generator includes a plurality of components that each have a nonlinear electrical reactance. A signal converter is coupled to the pulse generator and configured to convert the pulsed output signal into a pulsed radar transmit signal having a series of radar transmit pulses with a second PRF that is less than the first PRF.

Abstract: The sensitivity of a chemiresistor sensor can be dynamically tuned using mechanical strain. The increase in sensitivity is a smooth, continuous function of the applied strain, and the effect can be reversible. Sensitivity tuning enables the response curve of the sensor to be dynamically optimized for sensing analytes, such as volatile organic compounds, over a wide concentration range.

Abstract: Deterrence of device subversion by substitution may be achieved by including a cryptographic fingerprint unit within a computing device for authenticating a hardware platform of the computing device. The cryptographic fingerprint unit includes a physically unclonable function (“PUF”) circuit disposed in or on the hardware platform. The PUF circuit is used to generate a PUF value. A key generator is coupled to generate a private key and a public key based on the PUF value while a decryptor is coupled to receive an authentication challenge posed to the computing device and encrypted with the public key and coupled to output a response to the authentication challenge decrypted with the private key.

Abstract: Technologies pertaining to determining when glare will be perceived by a hypothetical observer from a glare source and the intensity of glare that will be perceived by the hypothetical observer from the glare source are described herein. A first location of a potential source of solar glare is received, and a second location of the hypothetical observer is received. Based upon such locations, including respective elevations, and known positions of the sun over time, a determination as to when the hypothetical observer will perceive glare from the potential source of solar glare is made. Subsequently, an amount of irradiance entering the eye of the hypothetical observer is calculated to assess potential ocular hazards.

Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

Abstract: Solar tracking systems, as well as methods of using such solar tracking systems, are disclosed. More particularly, embodiments of the solar tracking systems include lateral supports horizontally positioned between uprights to support photovoltaic modules. The lateral supports may be raised and lowered along the uprights or translated to cause the photovoltaic modules to track the moving sun.

Abstract: Various technologies pertaining to characterizing a component of a large surface area array electronic device, such as a focal plane array (FPA), are described. A first semiconductor chip is reversibly hybridized with a second semiconductor chip through use of a conductive layer. Responsive to being reversibly hybridized, at least one of the first semiconductor chip or the second semiconductor chip is characterized as being defective or suitable for deployment. Thereafter, the conductive layer is removed, and the first semiconductor chip is separated from the second semiconductor chip without damaging either of the first semiconductor chip or the second semiconductor chip.

Abstract: Accessing a workpiece object in semiconductor processing is disclosed. The workpiece object includes a mechanical support substrate, a release layer over the mechanical support substrate, and an integrated circuit substrate coupled over the release layer. The integrated circuit substrate includes a device layer having semiconductor devices. The method also includes etching through-substrate via (TSV) openings through the integrated circuit substrate that have buried ends at or within the release layer including using the release layer as an etch stop. TSVs are formed by introducing one or more conductive materials into the TSV openings. A die singulation trench is etched at least substantially through the integrated circuit substrate around a perimeter of an integrated circuit die. The integrated circuit die is at least substantially released from the mechanical support substrate.

Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.

Abstract: A method, system and apparatus, the method including positioning a microelectronic device on a carrier substrate; coupling the microelectronic device to a roller assembly; and rotating the roller assembly to transport the microelectronic device from the carrier substrate to a receiving substrate. The system including a carrier substrate configured to support a microelectronic device; a roller assembly configured to receive and transport the microelectronic device; and a receiving substrate dimensioned to receive the microelectronic device from the roller assembly. An apparatus for parallel assembly of microelectronic devices on a module including a laterally translatable carrier substrate configured to move a plurality of microelectronic devices in a first direction; a rotatable cylindrical body having a plurality of device openings dimensioned to receive the microelectronic devices; and a laterally translatable receiving substrate configured to move in a second direction.