Abstract: A non-volatile memory apparatus and corresponding method of operation are provided. The apparatus includes non-volatile memory cells in an integrated circuit device along with a microcontroller in communication with the non-volatile memory cells. The microcontroller is configured to receive a memory operation command and in response, determine a condition value of one of a plurality of conditions associated with the memory operation command and whether the one of the plurality of conditions is dynamic. In parallel, the microcontroller determines and outputs an output value using the condition value. The microcontroller then determines whether the one the plurality of conditions has changed. If the one of the plurality of conditions is dynamic and has changed, the microcontroller determines an updated condition value and in parallel, compares the condition value and the updated condition value and determines and outputs an updated output value using the updated condition value and the comparison.

Abstract: A method for programming three page user data in a memory array of a non-volatile memory system, comprising converting each three-bit value data pattern of the user data into a representative pair of two-bit data values, simultaneously programming two single-state memory cells with a first of the pair of representative two-bit data values, wherein the two single-state memory cells are located along a first common word line of two memory cell strings, and simultaneously programming two single-state memory cells with a second of the pair of representative two-bit data values, wherein the two single-state memory cells are located along a second common word line of the two memory cell strings.

Abstract: An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die based on one or more operational parameters. The control die is configured to calibrate the one or more operational parameters for the memory die. The control die is also configured to perform testing of the memory die using the calibrated one or more operational parameters.

Abstract: Technology for error correcting data stored in memory dies is disclosed. Codewords, which may contain data bits and parity bits, are stored on a memory die. The memory die is bonded to a control die through bond pads that allow communication between the memory die and the control die. The codewords are decoded at the control die based on the parity bits. If the control die successfully decodes a codeword, the control die may send the data bits but not the parity bits to a memory controller. By not sending the parity bits to the memory controller, substantial bandwidth is saved. Also, substantial power may be saved. For example, the interface between the control die and the memory controller could be a high speed interface.

Abstract: Technology is disclosed herein for per pin internal reference voltage generation for data receivers in non-volatile memory systems. A receiving circuit may have an on-die voltage generator that has inputs to receive a separate voltage magnitude select signal for each data receiver on the receiving circuit. The on-die voltage generator provides a separate reference voltage for each data receiver. This allows the reference voltage for each data receiver to be calibrated separately. A separate reference voltage for each data receiver compensates for variations between data paths, and provides for a wider data valid window than if the same reference voltage were used for all data receivers. Generating the different reference voltages on-die can potentially require a large area, as well as consume considerable power and/or current. A voltage divider and multiplexers may provide the different reference voltages, which saves space and is power and current efficient.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes a plurality of memory cells. Each of the plurality of memory cells is connected to one of a plurality of word lines and is arranged in one of a plurality of blocks. Each of the plurality of memory cells is configured to retain a threshold voltage corresponding to one of a plurality of data states. A control circuit is coupled to the plurality of word lines and is configured to detect at least one use characteristic of the memory apparatus. The control circuit adjusts a verify voltage level by one of a plurality of verify level offsets based on the at least one use characteristic that is detected. The verify voltage level is applied to the one of the plurality of word lines selected for programming following an application of a program voltage during a program operation.

Abstract: An apparatus that includes a word line with a plurality of memory cells that are able to be programmed to a plurality of data states is provided. The apparatus further includes a programming circuit. The programming circuit is configured to program the memory cells and count the number of verify pulses at a first verify voltage level that are performed during programming of the memory cells to a first programmed data state to determine a verify count. During programming to a second data state, the programming circuit applies a plurality of programming pulses at increasing voltage levels and a plurality of verify pulses at a second verify voltage level to the selected word line. During programming of the memory cells to the second programmed data state, the number of verify pulses is one fewer than the number of programming pulses and bitscan operations are skipped.

Abstract: Technology for limiting a voltage difference between two selected conductive lines in a cross-point array when using a forced current approach is disclosed. In one aspect, the selected word line voltage is clamped to a voltage limit while driving an access current through a region of the selected word line and through a region of the selected bit line. The access current flows through the memory cell to allow a sufficient voltage to successfully read or write the memory cell, while not placing undue stress on the memory cell. In some aspects, the maximum voltage that is permitted on the selected word line depends on the location of the selected memory cell in the cross-point memory array. This allows memory cells for which there is a larger IR drop to receive an adequate voltage, while not over-stressing memory cells for which there is a smaller IR drop.

Abstract: Technology for limiting a voltage difference between two selected conductive lines in a cross-point array when using a forced current approach is disclosed. In one aspect, the selected word line voltage is clamped to a voltage limit while driving an access current through a region of the selected word line and through a region of the selected bit line. The access current flows through the memory cell to allow a sufficient voltage to successfully read or write the memory cell, while not placing undue stress on the memory cell. In some aspects, the maximum voltage that is permitted on the selected word line depends on the location of the selected memory cell in the cross-point memory array. This allows memory cells for which there is a larger IR drop to receive an adequate voltage, while not over-stressing memory cells for which there is a smaller IR drop.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines and bit lines and arranged in strings and configured to retain a threshold voltage. Each of the memory cells is configured to be erased in an erase operation occurring during an erase time period. A control circuit is configured to adjust at least a portion of the erase time period in response to determining the erase operation is a segmented erase operation and is resumed after being suspended. The control circuit applies an erase signal having a plurality of voltage segments temporally separated from one another during the erase time period to each of the strings while simultaneously applying a word line erase voltage to selected ones of the word lines to encourage erasing of the memory cells coupled to the selected ones of the word lines in the segmented erase operation.

Abstract: An apparatus includes one or more control circuits configured to connect to a plurality of non-volatile memory cells through a plurality of word lines. The one or more control circuits are configured to, for each target word line of a plurality of target word lines to be read, select either a first neighboring word line or a second neighboring word line as a selected neighboring word line according to whether non-volatile memory cells of the first neighboring word line are in an erased condition. The one or more control circuits are further configured to determine a read voltage to read non-volatile memory cells of a corresponding target word line according to an amount of charge in non-volatile memory cells of the selected neighboring word line.

Abstract: Apparatuses and techniques are described for reducing the program time for a set of memory cells by using an enhanced step up of a program bias. A program operation includes a first pass in which memory cells are programmed to intermediate states and a second program pass in which the memory cells are programmed from an erased state and the intermediate states to final states. In the first program pass, program time can be reduced by applying an enhanced program bias step up to memory cells of the highest intermediate state in a single program loop, for example. The enhanced program bias step up can be achieved by applying a negative bit line voltage and can be triggered when the memory cells assigned to the second highest intermediate state reach a program milestone such as completing programming.

Abstract: To protect memory cards, such as SD type cards, and similar devices from Electrostatic Discharge (ESD), the input pads of the device include points along their edges that are aligned with correspond points on a conductive frame structure mounted adjacent the input pad to form a spark gap. The input pads are connected to a memory controller or other ASIC over signal lines that include a diode located between the input pad and the ASIC and a resistance located between the input pad and the diode. The resistance and diode are selected such that an ESD event at an input pad triggers a discharge across the spark gap before it is transmitted on to the ASIC, while also allowing a high data rate for signals along the signal line.

Abstract: A method of operating a memory system includes a first programming loop, which includes applying a first programming voltage to a control gate of a selected word line and applying a first bitline voltage to a bitline coupled to a first memory cell that is being programmed to a first data state and to a different bitline coupled to a second memory cell that is being programmed to a second data state. In a second programming loop, a second bitline voltage is applied to the bitline coupled to the first memory cell, and a third bitline voltage is applied to the bitline coupled to the second memory cell. The second bitline voltage is greater than the first bitline voltage to reduce a programming speed of the first bitline voltage to increase a programming speed of the second memory cell.

Abstract: Apparatuses and techniques are described for optimizing programming in a memory device in which memory cells can be programmed using single bit per cell programming and multiple bits per cell programming. In one aspect, a single bit per cell program operation is performed which reduces damage to the memory cells as well as reducing program time. The program operation can omit a pre-charge phase and a verify phase of an initial program loop of a program operation. Instead, a program phase is performed followed by a recovery phase. In one or more subsequent program loops of the single bit per cell program operation, as well as in each program loop of a multiple bit per cell program operation, the program loop includes a pre-charge phase, a program phase, a recovery phase and a verify phase.

Abstract: The non-volatile memory includes a control circuitry that is communicatively coupled to an array of memory cells that are arranged word lines. The control circuitry is configured to program the memory cells using a multi-pass programming operation which includes a first pass and a second pass. The first pass programs the memory cells to a first number of data states, and the second pass programs the memory cells to a greater second number of data states. For at least one word line, during the second pass, a voltage that is applied to at least one memory cell is reduced from a verify voltage by an offset which is determined as a function of a data state of an adjacent memory cell of an adjacent word line and wherein the first pass but not the second pass has been completed in the adjacent word line.

Abstract: Apparatuses and techniques are described for reducing damage to memory cells during single bit per cell programming. An initial program pulse in a single bit per cell program operation has a lower, first program level followed by a higher, second program level. As a result of the lower, first program level, the electric field across the memory cells is reduced. The step up time from the first program level to the second program level can be reduced by concurrently stepping up pass voltages of the adjacent unselected word lines. If an additional program pulse is applied, the step up in the program pulse can be omitted. The magnitude of the first program level can be adjusted based on factors such as temperature, number of program-erase cycles, selected sub-block position and selected word line position.

Abstract: The disclosure relates in some aspects to managing the fetching and execution of commands stored in submission queues. For example, execution of a command may be blocked at a data storage apparatus due to an internal blocking condition (e.g., a large number of commands of a particular type are pending for execution at the data storage device). As another example, execution of a command may be blocked at a data storage apparatus due to an external blocking condition (e.g., a host device may specify that certain commands are to be executed immediately one after another). The disclosure relates in some aspects to controlling how commands are fetched and executed so that commands that cannot be executed by the data storage apparatus in the near future do not prevent other commands (that are not subject to the same blocking condition) from being executed.

Abstract: An apparatus that includes a word line with a plurality of memory cells that are able to be programmed to a plurality of data states is provided. The apparatus further includes a programming circuit. The programming circuit is configured to program the memory cells and count the number of verify pulses at a first verify voltage level that are performed during programming of the memory cells to a first programmed data state to determine a verify count. During programming to a second data state, the programming circuit applies a plurality of programming pulses at increasing voltage levels and a plurality of verify pulses at a second verify voltage level to the selected word line. During programming of the memory cells to the second programmed data state, the number of verify pulses is one fewer than the number of programming pulses and bitscan operations are skipped.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines and bit lines and configured to retain a threshold voltage corresponding to one of a plurality of data states following a program operation. A control circuit is coupled to the word lines and the bit lines. The control circuit is configured to count a bit-scan quantity of the memory cells during a bit-scan of the program operation. The control circuit determines whether the bit-scan quantity of the plurality of memory cells is greater than at least one predetermined bit-scan threshold. In response to the bit-scan quantity of the memory cells being greater than the at least one predetermined bit-scan threshold, the control circuit is configured to adjust a word line ramp rate of a word line voltage applied to the word lines during the program operation.