Abstract: Apparatus for sticking nonconductive tape including plating perforations to sheet metal comprises supply means for metal tape, feed means for nonconductive tape, punching means for perforating nonconductive tape to make plating perforations therein, a device for heating and pressure-sticking the metal tape and the perforated nonconductive tape together, cooling means for the tapes, and control means for monitoring the position of the plating perforations and controlling the running speed of the nonconductive tape.