Abstract: A purpose of the present disclosure is to provide a fine pattern transfer mold and a fine pattern molding method that allow high-resolution transfer of a fine pattern to the interior of a hollow product by integral molding. In a product formation chamber that is formed between a cavity and a core pin member having a predetermined portion at which a fine pattern original plate is fixed by closing of a mold body, a gate into which a molten resin material flows from a hot runner member has an opening that is located outside an end of a fixed surface of the fine pattern original plate in a horizontal direction of the fixed surface and that faces the end of the fixed surface, an injection nozzle of the hot runner member and the gate are directly coupled together, and the hollow product is integrally molded by the resin material flowing from the gate.

Abstract: A purpose of the present disclosure is to provide a fine pattern transfer mold and a fine pattern molding method that allow high-resolution transfer of a fine pattern to the interior of a hollow product by integral molding. In a product formation chamber that is formed between a cavity and a core pin member having a predetermined portion at which a fine pattern original plate is fixed by closing of a mold body, a gate into which a molten resin material flows from a hot runner member has an opening that is located outside an end of a fixed surface of the fine pattern original plate in a horizontal direction of the fixed surface and that faces the end of the fixed surface, an injection nozzle of the hot runner member and the gate are directly coupled together, and the hollow product is integrally molded by the resin material flowing from the gate.

Abstract: There is provided a transparent or semitransparent resin composition which can be easily cut. The resin composition can be obtained by mixing a methacrylic resin with an ethylene·vinyl acetate copolymer resin, polybutene-1, polypropylene resin, ionomer and low-density polyethylene in a specific ratio.