Abstract: A memory/storage module is provided that implements a solid state drive compatible with Serial Advanced Technology Attachment (SATA) or Serial Attached SCSI (SAS) signaling on a double-data-rate compatible socket. A detachable daughter card may be coupled to the memory module for converting a memory bus voltage to a second voltage for memory devices on the memory module. Additionally, a hybrid memory bus on a host system is provided that supports either DDR-compatible memory modules and/or SATA/SAS-compatible memory modules. In one example, the memory/storage module couples to a first bus (DDR3 compatible socket) to obtain voltage and/or other signals, but uses a second bus for data transfers. In another example, the memory module may repurpose/reuse electrical paths that typically carry non-data signals for data traffic to/from the memory/storage module. Such data traffic for the memory/storage module permits concurrent data traffic for other memory modules on the same memory bus.

Abstract: A memory/storage module is provided that implements a solid state drive compatible with Serial Advanced Technology Attachment (SATA) or Serial Attached SCSI (SAS) signaling on a double-data-rate compatible socket. A detachable daughter card may be coupled to the memory module for converting a memory bus voltage to a second voltage for memory devices on the memory module. Additionally, a hybrid memory bus on a host system is provided that supports either DDR-compatible memory modules and/or SATA/SAS-compatible memory modules. In one example, the memory/storage module couples to a first bus (DDR3 compatible socket) to obtain voltage and/or other signals, but uses a second bus for data transfers. In another example, the memory module may repurpose/reuse electrical paths that typically carry non-data signals for data traffic to/from the memory/storage module. Such data traffic for the memory/storage module permits concurrent data traffic for other memory modules on the same memory bus.

Abstract: A rack system for housing electronic and/or electrical equipment is provided comprising a rectangular base frame, a rectangular top frame, and four elongated vertical support members each extending along a longitudinal axis between and joined to two associated corners of the rectangular base frame and the rectangular top frame. The rectangular base frame, rectangular top frame, and the four elongated vertical support members may be constructed from members having the same substantially A-frame cross-section. Each support member may be constructed from an elongated sheet material extending along a longitudinal axis by bending the sheet material about an axis parallel to the longitudinal axis of the sheet material to form at least three elongated sections, where a first section and a second section are adjacent and substantially perpendicular to each other and a third section extends between approximately mid-point of the first section and approximately mid-point of the second section.

Abstract: Methods and/or devices are provided for monitoring life-expectancy and/or useful life of an optical transceiver module by tracking an insertion cycle count of an optical transceiver module. An alarm/warning indicator may be generated or the optical transceiver module can be disabled completely if the insertion cycle count exceeds a predefined threshold. The host device first detects the insertion of the optical transceiver module and then reads the cycle count along with an identifier value from the non-volatile memory of the optical transceiver module. The host device then increments the insertion cycle count by one, to account for the current insertion, and stores this new cycle count into a non-volatile memory of the optical transceiver module. The insertion cycle count value may be encrypted and/or the non-volatile memory of the optical transceiver module may be password-protected to avoid accidental and/or unauthorized access to the non-volatile memory of the optical transceiver module.

Abstract: A technique for climate control of, for example, base station circuitry within an enclosure involves placing base station circuitry within the enclosure and controlling the climate therein. A system according to this technique includes an enclosure suitable for use outside in a wide range of extreme weather conditions. A controller may, for example, control a fan tray with a heater to pull ambient air through a filtration unit, through the fan tray where the air is heated, and through cold start recirculation dampers.

Abstract: A rack system for electronic and/or electrical equipment including a frame, a front door mounted to the front of the frame, a back door or panel, two side panels mounted to the back and two sides of the frame, and a top panel mounted to the top of the frame. The doors can be single doors or dual doors. The frame includes a rectangular base frame constructed by four horizontal edge members, and a top frame having the same structure as the base frame, and four vertical members each extending between two associate corners of the base frame and the top frame, and joining the base frame and top frame together. The horizontal members and vertical members are contoured with step-like structures, so that the rack has a high stiffness and strength. The door includes a hinge and a latch attached to two vertical members. The panels are provided with tabs and latches for securing the panels to the frame.

Abstract: A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a second conductive layer coupled to a second surface of the first dielectric layer, and (4) a localized distributive non-discrete capacitive element adjacent the first conductive layer, wherein the capacitive element occupies a region that approximately coincides with a location over which a device to be coupled to the capacitive element is to be mounted. The embedded, localized, non-discrete, and distributive capacitive element may provide device-specific capacitance to suppress voltage/current noise for a particular device.

Abstract: A built-in dual purpose interposer device for a data storage device carrier mechanism is provided. The interposer device may fill empty or voided space in the carrier mechanism created when a data storage device is changed between a “direct plug” position, or first configuration, and an “interposer” position, or second configuration. The interposer device may be changed back and forth between the first and second configuration multiple times. When in the first configuration, the interposer device may provide structural support to a front end of the carrier mechanism and when in the second configuration, the interposer device may provide an internal mounting base for the data storage device at the base or bottom end of the carrier mechanism. The ability to interchange the interposer device may provide for a built-in base for attaching the interposer device without having to add in additional parts or costs.

Abstract: A memory/storage module is provided that implements a solid state drive compatible with Serial Advanced Technology Attachment (SATA) or Serial Attached SCSI (SAS) signaling on a double-data-rate compatible socket. A detachable daughter card may be coupled to the memory module for converting a memory bus voltage to a second voltage for memory devices on the memory module. Additionally, a hybrid memory bus on a host system is provided that supports either DDR-compatible memory modules and/or SATA/SAS-compatible memory modules. In one example, the memory/storage module couples to a first bus (DDR3 compatible socket) to obtain voltage and/or other signals, but uses a second bus for data transfers. In another example, the memory module may repurpose/reuse electrical paths that typically carry non-data signals for data traffic to/from the memory/storage module. Such data traffic for the memory/storage module permits concurrent data traffic for other memory modules on the same memory bus.

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing information for each circuit board at various manufacturing stages as well as the operating conditions for each stage at a particular time. Such manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier printed on the circuit board.

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing information for each circuit board at various manufacturing stages as well as the operating conditions for each stage at a particular time. Such manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier printed on the circuit board.

Abstract: A rack system for housing electronic and/or electrical equipment is provided comprising a rectangular base frame, a rectangular top frame, and four elongated vertical support members each extending along a longitudinal axis between and joined to two associated corners of the rectangular base frame and the rectangular top frame. The rectangular base frame, rectangular top frame, and the four elongated vertical support members may be constructed from members having the same substantially A-frame cross-section. Each support member may be constructed from an elongated sheet material extending along a longitudinal axis by bending the sheet material about an axis parallel to the longitudinal axis of the sheet material to form at least three elongated sections, where a first section and a second section are adjacent and substantially perpendicular to each other and a third section extends between approximately mid-point of the first section and approximately mid-point of the second section.

Abstract: The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.

Abstract: A memory module is provided comprising a substrate having an interface to a host system, volatile memory, non-volatile memory, and a logic device. The logic device may receive the indicator of an external triggering event and copies data from the volatile memory devices to the non-volatile memory devices upon receipt of such indicator. When the indicator of the triggering event has cleared, the logic device restores the data from the non-volatile to the volatile memory devices. The memory module may include a passive backup power source (e.g., super-capacitor) that is charged by an external power source and temporarily provides power to the memory module to copy the data from volatile to non-volatile memory. A voltage detector within the memory module may monitor the voltage of an external power source and generates an indicator of a power loss event if voltage of the external power source falls below a threshold level.

Abstract: A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded electrically conductive elements. An electrically conductive undercoat may be applied over the surface of the conductive layer and a second circuit pattern is formed over the electrically conductive undercoat.

Abstract: Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

Abstract: On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.