Patents Assigned to Sansui Co., Ltd.
  • Publication number: 20260014539
    Abstract: The present invention provides: hollow particles which enable a lower dielectric constant and a lower dielectric loss tangent of a resin composition and a production method therefor. The hollow particles of the present invention have a shell portion formed by a polymer of a monomer component including a divinyl aromatic compound and a monovinyl aromatic compound and a hollow portion surrounded by the shell portion, in which a dielectric loss tangent measured by cavity resonance method (frequency: 10 GHz (room temperature)) is 1.00×10?3 or less. The hollow particles can be produced by mixing the monomer component and a predetermined hydrophobic solvent, by further mixing water, by polymerizing the monomer component in an emulsion liquid obtained, and by washing a resulting polymer with water and an organic solvent.
    Type: Application
    Filed: November 22, 2023
    Publication date: January 15, 2026
    Applicant: SANSUI CO., LTD.
    Inventors: Mamoru SAKAI, Makoto SAKAI
  • Patent number: 5378534
    Abstract: The recording sheet is formed by coating colored sheets with an opacifying compound prepared by mixing an aqueous suspension of polymer particles embodying internal voids dispersed with a water base coating material.
    Type: Grant
    Filed: July 22, 1992
    Date of Patent: January 3, 1995
    Assignee: Sansui Co., Ltd.
    Inventors: Norio Kuroanagi, Mamoru Sakai