Abstract: A blackbody radiometric reference comprising a source plate or a target plate, metallic nanoparticles or other high emissivity coating disposed on the plate, and an intermediate coating such as paint. The plate may comprise copper, aluminum or composites thereof. Apparatus capable of functioning as a radiometric or thermometric reference. A pre-heater or weakly-coupled area may be disposed around or adjacent a highly thermally uniform area. A groove or perforations extending into a front surface of the source plate defining a weakly-coupled edge portion surrounding a thermally-controlled, optically-active area, and connected by bridges or structures thereto. An external probe may be located near the source plate for measuring ambient temperature, for compensating for ambient temperature or for radiative load on the blackbody.

Abstract: A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

Abstract: A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

Abstract: Sub-arrays such as tiles or chips having pixel elements arranged on a routing layer or carrier to form a larger array. Through-chip vias or the like to the backside of the chip are used for connecting with the pixel elements. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry and the electrically active portions of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures are disclosed.

Abstract: Sub-arrays such as tiles or chips having pixel elements arranged on a routing layer or carrier to form a larger array. Through-chip vias or the like to the backside of the chip are used for connecting with the pixel elements. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry and the electrically active portions of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures are disclosed.

Abstract: A sighting assembly comprising a housing having a first portion and a second portion has mounted within the first portion thereof a laser rangefinder comprising a laser transceiver for transmitting a laser beam toward a target and for receiving a reflected laser beam from the target. The laser rangefinder is coupled to a display for indicating the distance to the target. Mounted within the second portion of the housing is a sight for viewing the target. The sighting assembly further includes at least one attachment on the housing for securing the assembly to a weapon.

Abstract: An optical feedback technique is utilized for accurately determining the angular orientation of a collimator relative to an electro-optical (EO) system, and for aligning the two. A mirror assembly mounted on the EO system comprises a plurality of mirror elements positioned to receive light from the exit aperture of the collimator and to reflect the light back into the collimator through the aperture, each of the mirror elements having a reflecting surface oriented at a predetermined, unique angle. A beam of light reflected from one of the plurality of mirror elements forms a light spot on a photosensitive surface at the focal plane of the collimator. The relative orientation of the collimator and the EO system is determined by comparing the position of the light spot on the photosensitive surface with a reference position.

Abstract: An optical feedback technique is utilized for accurately determining the angular orientation of a collimator relative to an electro-optical (EO) system, and for aligning the two. A mirror assembly mounted on the EO system comprises a plurality of mirror elements positioned to receive light from the exit aperture of the collimator and to reflect the light back into the collimator through the aperture, each of the mirror elements having a reflecting surface oriented at a predetermined, unique angle. A beam of light reflected from one of the plurality of mirror elements forms a light spot on a photosensitive surface at the focal plane of the collimator. The relative orientation of the collimator and the EO system is determined by comparing the position of the light spot on the photosensitive surface with a reference position.