Abstract: A gas filling device of wafer carrier with a function of monitoring gas property at gas discharge end includes a mass flow controller, a gas intake end coupled to the mass flow controller, a gas discharge end, a gas collection box coupled to the gas discharge end, and a gas property measuring device coupled to the gas collection box. When use, the gas intake end and the gas discharge end are coupled to a wafer carrier, and the mass flow controller controls a gas to fill from the gas intake end into the wafer carrier, and an exhaust gas is discharged from the gas discharge end, after a numeric value of a gas property of the gas discharged from the wafer carrier is measured by the gas property measuring device.

Abstract: A wafer pod gas charging apparatus includes a machine, on which different types of nozzles are introduced. One type of the nozzles is designed to have an inner tube elastically movable in an outer sleeve. When a wafer pod having gas ports of a specific depth is placed on the machine for charging gas, the exact type of the wafer pod can be detected by a sensor unit on the machine and the gas ports of the wafer pod can properly engage with one matching type of the nozzles on the machine to enable the gas charging. Therefore, by changing the structural designs of the nozzles on the machine, the same one machine is adapted to charge gas into different types of wafer pods at reduced cost.