Patents Assigned to Sanwa Chemical Industry Co., Ltd.
  • Polyamide base binder for use in metal powder injection molding process
    Patent number: 5002988
    Abstract: A polyamide binder for use in injection molding a metal powder comprising in combination: (a) 40 to 50 wt % of a polyamide resin component having an average molecular weight of not less than 20,000 and prepared by co-polycondensation of a mixture of dimer acid, azelaic acid, ethylenediamine and xylylenediamine each being mixed in a substantially equal molecular equivalent ratio; (b) 20 to 30 wt % of ethylene-bis-laurylamide; and (c) the balance of N,N-diacetylpiperazine.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: March 26, 1991
    Assignee: Sanwa Chemical Industry Co., Ltd.
    Inventors: Hiroshi Ono, Katuyoshi Saitoh, Haruo Yagami, Takeo Saiki, Yoshimichi Masuda