Patents Assigned to SANWA SYSTEM ENGINEERING CO., LTD.
  • Patent number: 8679387
    Abstract: A compression molding apparatus for particulate matter comprising a magnetostrictive actuator functioning as an impact force applying means arranged at least between an upper ram or a lower ram and an upper punch or a lower punch. Particulate matter is compressed by a static pressure, and then an impact force is applied to the particulate matter to reduce internal stress. After compressing the particulate matter by the static pressure, the upper ram is allowed to fall gravitationally to shorten a molding time.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: March 25, 2014
    Assignee: Sanwa System Engineering Co., Ltd.
    Inventors: Hisao Yoshioka, Sigeyasu Ito
  • Publication number: 20120161354
    Abstract: A compression molding apparatus for particulate matter comprising a magnetostrictive actuator functioning as an impact force applying means arranged at least between an upper ram or a lower ram and an upper punch or a lower punch. Particulate matter is compressed by a static pressure, and then an impact force is applied to the particulate matter to reduce internal stress. After compressing the particulate matter by the static pressure, the upper ram is allowed to fall gravitationally to shorten a molding time.
    Type: Application
    Filed: June 23, 2010
    Publication date: June 28, 2012
    Applicant: SANWA SYSTEM ENGINEERING CO., LTD.
    Inventors: Hisao Yoshioka, Sigeyasu Ito