Patents Assigned to Sanyo Semoconductor Co., Ltd.
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100044839
    Abstract: Provided are a semiconductor device and a method of manufacturing the same. In semiconductor devices of the conventional technologies, the chip size is increased when a breakdown voltage is increased. In the semiconductor device of this invention, an end of a pn junction interface (5) of a collector region (2) and a base region (3) is formed of a mesa groove (6) made of a trench. Thus, the chip size is not increased even when the mesa groove (6) is deeply formed to increase the breakdown voltage.
    Type: Application
    Filed: October 12, 2007
    Publication date: February 25, 2010
    Applicants: Sanyo Electric Co., Ltd., Sanyo Semoconductor Co., Ltd.
    Inventors: Kikuo Okada, Kojiro Kameyama