Abstract: Provided is a light-emitting device package having a high reflectance and strength. In a light-emitting device package (10) containing: a glass ceramic (21) as a major component; and a high refractive index material (23) having a higher refractive index than the glass ceramic, and being for housing a light-emitting element (2) therein and reflecting light emitted from the light-emitting element (2) toward a predetermined direction, the high refractive index material (23) is a silicate compound.

Abstract: A connector device includes a circuit board and a connector body, and the connector body includes a housing and a connection terminal provided inside the housing. A silicon resin is applied to fill a gap between the connector body and the circuit board. The application of the silicon resin can prevent a mold resin used to seal the connector device and a battery pack body from entering from the gap into the housing. Thereby, a connector device reliably establishing conduction and a battery pack applying such a connector device can be obtained.

Abstract: An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.

Abstract: The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C.

Abstract: In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body.

Abstract: A package for an electron element comprises: a base substrate made of ceramic; a frame body made of ceramic arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the electron element; a via formed in the base substrate below the cavity, penetrating the base substrate from the top surface to a bottom surface thereof and filled with a thermally-conductive material; and a projecting part formed on an inner wall of the via and projecting toward a center of the via. The projecting part has a length along a direction perpendicular to a penetration direction of the via not less than a thickness along the penetration direction. An electronic component comprises the package and the electron element mounted thereon. The electron element is accommodated in the cavity defined inside the frame body of the package and arranged above the via.

Abstract: A fabrication method of battery pack device includes the steps of: preparing a plurality of protection circuit substrates disposed apart from each other in a space of a frame, and supported to the frame via a bridge member; attaching a connector component to a top face side of each of the protection circuit substrates; moving a leading end of a sealing material feeder towards the connector component from a bottom side of the protection circuit substrate and supplying a sealing material to a bottom end of the connector component; infiltrating the sealing material into a gap between the connector component and the protection circuit substrate, along a circumference at the bottom end of the connector component to seal the gap with the sealing material.

Abstract: In a receiving unit, an AGC circuit controls the gain of a high frequency amplifier based on an output signal of a mixer, that is, an intermediate frequency signal obtained before an unnecessary frequency component is removed by a BPF. Therefore, deterioration in the distortion characteristic of the mixer can be suppressed more effectively than a conventional case where the gain of the high frequency amplifier is controlled based on an intermediate frequency signal that has passed through the BPF and amplified by an intermediate frequency amplifier.

Abstract: A correction circuit comprised of a capacitor and a switch is attached to a resonator such that a single resonance circuit is used to cover the television signals of a plurality of bands. Furthermore, the number of the components in the tuner circuit is reduced. A television tuner functions to receive a television broadcast signal divided into a plurality of frequency bands for conversion into an intermediate frequency signal of a predetermined frequency. The television tuner includes a resonance circuit controlling a frequency of a local oscillation signal which oscillates within a predetermined frequency band. During reception of a first frequency band, a tuning voltage is applied to a variable circuit element included in the resonance circuit to control the frequency of the local oscillation signal.

Abstract: An analog/digital-compatible front-end module comprises a high frequency amplifier 9 for amplifying a high frequency signal received by an antenna 1; a frequency converter circuit 11 for frequency-converting an output signal from the high frequency amplifier 9 to output an intermediate frequency signal; an analog demodulator 5; a digital demodulator 6; an analog/digital switch 4 for selectively feeding an output signal from the frequency converter circuit 11 to the analog demodulator 5 or to the digital demodulator 6; and an AGC signal switch 7 for controlling gain of the high frequency amplifier 9 in accordance with a gain control signal obtained from the analog demodulator 5 during an analog broadcast reception, while controlling gain of the high frequency amplifier 9 in accordance with a gain control signal produced from the output signal from the frequency converter circuit 11 during a digital broadcast reception.

Abstract: A connector device includes a circuit board and a connector body, and the connector body includes a housing and a connection terminal provided inside the housing. A silicon resin is applied to fill a gap between the connector body and the circuit board. The application of the silicon resin can prevent a mold resin used to seal the connector device and a battery pack body from entering from the gap into the housing. Thereby, a connector device reliably establishing conduction and a battery pack applying such a connector device can be obtained.

Abstract: A television reception circuit includes a high-frequency amplifier amplifying a received television signal, a mixer frequency-converting the amplified television signal to an intermediate-frequency signal, a filter attenuating a component outside a prescribed frequency band in the resultant intermediate-frequency signal, a first AGC circuit outputting a first gain control signal for setting a level of the intermediate-frequency signal output from the mixer to a prescribed value, a second AGC circuit outputting a second gain control signal for setting a level of the signal that has passed through the filter to a prescribed value, and a switch selecting any one of the first gain control signal and, the second gain control signal and outputting the selected gain control signal to the high-frequency amplifier, and the high-frequency amplifier amplifies the television signal with gain based on the gain control signal received from the switch.

Abstract: A circuit board connector includes a main body portion, a first connecting portion for connection to a first circuit board, and a second connecting portion for connection to a second circuit board. The circuit board connector is obtained by cutting a conductive plate material provided with plating layers on front and back sides thereof, and thereafter forming the second connecting portion into a shape having an annular transverse cross section in such a manner that one of the plating layers forms an outer circumferential surface of the second connecting portion.

Abstract: An analog/digital-compatible front-end module comprises a high frequency amplifier 9 for amplifying a high frequency signal received by an antenna 1; a frequency converter circuit 11 for frequency-converting an output signal from the high frequency amplifier 9 to output an intermediate frequency signal; an analog demodulator 5; a digital demodulator 6; an analog/digital switch 4 for selectively feeding an output signal from the frequency converter circuit 11 to the analog demodulator 5 or to the digital demodulator 6; and an AGC signal switch 7 for controlling gain of the high frequency amplifier 9 in accordance with a gain control signal obtained from the analog demodulator 5 during an analog broadcast reception, while controlling gain of the high frequency amplifier 9 in accordance with a gain control signal produced from the output signal from the frequency converter circuit 11 during a digital broadcast reception.

Abstract: A land grid array package has a construction in which a device-side ground electrode 6 and a substrate-side ground electrode 9, as well as device-side peripheral electrodes 7 and substrate-side peripheral electrodes 10 are soldered by eutectic solder 16. The land grid array package is characterized in that one or more gas-vent through holes 15 passing through a package substrate 3 are formed within a soldering region 18 of the device-side ground electrode 6. Thus, a land grid array package that can prevent short circuits or disconnections is provided.

Abstract: The present invention provides a shield case comprising a frame body having an interior divided by partition plates and housing electronic components therein and a closure for providing electric shield by covering an opening portion of the frame body, and having a slit piece integrally formed with the closure by cutting out a part of the closure along a periphery except for a base portion to a raised form, the slit piece for coming into contact with an end of the partition plate, the slit piece being formed in a gutter shape from the base portion to the other end. Furthermore, the slit piece has the gutter shape which becomes greater in curvature radius from the base portion to the other end. This enables the shield case of the high-frequency device of the present invention to strengthen the contact between the slit piece formed with the closure for providing grounding and the partition plates provided within the frame body, whereby the reliable high-frequency device can be provided.

Abstract: A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member 6, and moving a printing squeegee along the upper surface of the metal mask 1 to thereby print a lead-free solder paste on the surface of the electrode 21 on the circuit board 2. The method produces on the electrode 21 of the circuit board 2 two lead-free solder paste patterns 30a, 30a each circular or elliptical in shape and arranged in a direction in which the lead member 6 is to extend from the electrode.

Abstract: In a tag device wherein a wire 2 has a base end 21 fixed to a tag body 10 and a forward end 23 connected to the tag body 10 as releasably locked thereto, the wire 2 is provided at its forward end 23 with a lock pin 22. The tag body 10 comprises a case 1 having a pin insertion hole 13, and a latch member 3 engageable with the lock pin 22. The latch member 3 comprises a main body 31 supported inside the case 1 and a spring piece 32 provided on the main body 31. The latch member 3 prevents the thick rod portion 26 from slipping off when moved in one direction to a limit position, and allows the thick rod portion 26 to slip off when moved in the other direction to a limit position.

Abstract: The present invention provides an ingress-egress monitoring system comprising transmitting antennas 1 disposed respectively at a plurality of ingress-egress gates, tags 2 to be attached to respective persons to be checked for egress and each adapted to transmit an identification signal in response to radio waves received from the antenna 1, receivers 3 disposed respectively at the ingress-egress gates for receiving the identification signal from the tag and each operable to output a monitoring signal containing an ID code contained in the identification signal and the number of the gate of its own, and a monitor 5 connected to the receivers 3 for displaying the ID code and the gate number based on the monitoring signal output from the receiver 3. The tags 2 transmit the respective identification signals in cycles different one another.

Abstract: The invention provides an antitheft system comprising an alarm unit 1 attachable to a commodity, and an antitheft gate 2 installed in the vicinity of an exit of a store and having incorporated therein a transmitting circuit for producing an alarm activating signal for the alarm unit 1. The alarm unit 1 comprising a buzzer 1, receiving antenna 15 and control circuit 18. The control circuit 18 comprises an interrupt detecting circuit 18b alternatively settable in an interrupt permitting mode wherein the signal received by the antenna 15 is permitted to pass through the circuit 18b or an interrupt prohibiting mode wherein the received signal is prevented from passing therethrough, and a CPU 18a for judging whether the received signal input from the interrupt detecting circuit 18b is the alarm activating signal.