Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element mounted on a substrate by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle for supplying the liquid resin R, and brings the tip of the nozzle close to the optical semiconductor element and then supplies the liquid resin R while raising the nozzle. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: The invention provides a polyurethane resin composition for electrical insulation that has excellent compatibility between an isocyanate component and a polyol component, and that exhibits excellent heat resistance, moisture resistance, and insulation properties. The polyurethane resin composition for electrical insulation comprises (1) Part A comprising a polyisocyanate component obtained from at least one member selected from the group consisting of aliphatic diisocyanates and alicyclic diisocyanates, and containing one or more isocyanurate groups and one or more allophanate groups; and (2) Part B comprising a polyol component, wherein the polyisocyanate component has a molar ratio, (a)/(b), of isocyanurate groups (a) to allophanate groups (b) of 85/15 to 15/85.

Abstract: The present invention provides a method for forming resin bodies at a reduced production cost. The method for forming resin bodies according to the present invention comprises dispensing a liquid resin L from a dispenser 3 at multiple positions on a substrate 10 to form resin bodies R, the dispensing operation of the dispenser 3 being adjustable depending on the positions.

Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: The invention provides a polyurethane resin composition for electrical insulation that has excellent compatibility between an isocyanate component and a polyol component, and that exhibits excellent heat resistance, moisture resistance, and insulation properties. The polyurethane resin composition for electrical insulation comprises (1) Part A comprising a polyisocyanate component obtained from at least one member selected from the group consisting of aliphatic diisocyanates and alicyclic diisocyanates, and containing one or more isocyanurate groups and one or more allophanate groups; and (2) Part B comprising a polyol component, wherein the polyisocyanate component has a molar ratio, (a)/(b), of isocyanurate groups (a) to allophanate groups (b) of 85/15 to 15/85.

Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.

Abstract: A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.

Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.

Abstract: A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.

Abstract: An object of the present invention is to present a fabrication method for electronic components that allows further reduction in the size of electronic components by making the semiconductor substrate thinner, and at the same time allows operation as an electronic circuit with no problems, and further, has a durability sufficient to endure even use in a mobile telephone. In order to attain this object, the present invention has a first application process (process S12) in which encapsulating resin is applied to the surface of the substrate on which the posts are formed, a back surface grinding process (process S18) in which the back surface of said substrate is ground, a second application process (process S20) in which an encapsulating resin is applied to the back surface of said substrate after being ground, and a separation process (process S26) in which said substrate is cut along with said encapsulating resin and at the same time individual electronic components are separated.

Abstract: The invention provides a method for producing semiconductor packages comprising the steps of forming electronic circuits for a plurality of semiconductor chips 11 on a wafer 1, forming bumps 2 on the plurality of semiconductor chips 11, encapsulating the circuit-forming surface 111 of the wafer 1 and the bumps 2 with a sealant by screen printing means to form a sealant layer 4, curing the sealant layer 4, grinding the surface of the sealant layer 4 until the upper end surface of the bump 2 becomes exposed, placing solder balls on said upper end surface of bumps 2 to weld the balls to the surface thereof, and dicing the wafer 1 and the sealant layer 4 as united into individual semiconductor chips 11. Screen printing means is used to encapsulate the entire surface of the wafer with a resin, so that the equipment costs can be markedly reduced as compared with conventional methods using a mold.